Progress
Quantity
1208
Category
1. Cast iron plain Hand lapping plate -dia- 6 inch- 30 mm thick
Bid Type
Two Packet Bid
Public procurement opportunity for Nuclear Power Corporation Of India Limited 1. Cast iron plain Hand lapping plate -dia- 6 inch- 30 mm thick, 2. Cast iron plain Hand lapping plate -dia- 12 inch- 30 mm thick, 3. Cast iron plain Hand lapping plate -dia- 18 inch- 30 mm thick, 4. Copper hand polishing plate mounted on MS base plate -dia- 6 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate, 5. Copper hand polishing plate mounted on MS base plate -dia- 12 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate, 6. Copper hand polishing plate mounted on MS base plate -dia- 18 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate, 7. Diamond lapping compound having grades of grain size 10 microns and packing in 5 gms of syringe, 8. Diamond lapping compound having grades of grain size 15 microns and packing in 5 gms of syringe, 9. Diamond lapping compound having grades of grain size 25 microns and packing in 5 gms of syringe, 10. Diamond lapping compound having grades of grain size 45 microns and packing in 5 gms of syringe, 11. Diamond lapping compound having grades of grain size 70 microns and packing in 5 gms of syringe, 12. Diamond lapping compound having grades of grain size 90 microns and packing in 5 gms of syringe, 13. Lapping abrasive liquid having grain size of 03 microns suitable for use in electrically operated lapping machine in SURAT, GUJARAT. Quantity: 1208 issued by. Submission Deadline: 27-02-2026 14: 00: 00. View full details and respond.
Tender Category
Goods
Bid To RA
No
Bid To RA Enabled
No
Item Category
1. Cast iron plain Hand lapping plate -dia- 6 inch- 30 mm thick , 2. Cast iron plain Hand lapping plate -dia- 12 inch- 30 mm thick , 3. Cast iron plain Hand lapping plate -dia- 18 inch- 30 mm thick , 4. Copper hand polishing plate mounted on MS base plate -dia- 6 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 5. Copper hand polishing plate mounted on MS base plate -dia- 12 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 6. Copper hand polishing plate mounted on MS base plate -dia- 18 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 7. Diamond lapping compound having grades of grain size 10 microns and packing in 5 gms of syringe , 8. Diamond lapping compound having grades of grain size 15 microns and packing in 5 gms of syringe , 9. Diamond lapping compound having grades of grain size 25 microns and packing in 5 gms of syringe , 10. Diamond lapping compound having grades of grain size 45 microns and packing in 5 gms of syringe , 11. Diamond lapping compound having grades of grain size 70 microns and packing in 5 gms of syringe , 12. Diamond lapping compound having grades of grain size 90 microns and packing in 5 gms of syringe , 13. Lapping abrasive liquid having grain size of 03 microns suitable for use in electrically operated lapping machine
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Main Document
OTHER
BOQ
BOQ
GEM_GENERAL_TERMS_AND_CONDITIONS
1. Cast iron plain Hand lapping plate -dia- 6 inch- 30 mm thick
Details As per Specification Sheet
2. Cast iron plain Hand lapping plate -dia- 12 inch- 30 mm thick
Details As per Specification Sheet
3. Cast iron plain Hand lapping plate -dia- 18 inch- 30 mm thick
Details As per Specification Sheet
4. Copper hand polishing plate mounted on MS base plate -dia- 6 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate
Details As per Specification Sheet
5. Copper hand polishing plate mounted on MS base plate -dia- 12 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate
Details As per Specification Sheet
6. Copper hand polishing plate mounted on MS base plate -dia- 18 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate
Details As per Specification Sheet
7. Diamond lapping compound having grades of grain size 10 microns and packing in 5 gms of syringe
Details As per Specification Sheet
8. Diamond lapping compound having grades of grain size 15 microns and packing in 5 gms of syringe
Details As per Specification Sheet
9. Diamond lapping compound having grades of grain size 25 microns and packing in 5 gms of syringe
Details As per Specification Sheet
10. Diamond lapping compound having grades of grain size 45 microns and packing in 5 gms of syringe
Details As per Specification Sheet
11. Diamond lapping compound having grades of grain size 70 microns and packing in 5 gms of syringe
Details As per Specification Sheet
12. Diamond lapping compound having grades of grain size 90 microns and packing in 5 gms of syringe
Details As per Specification Sheet
13. Lapping abrasive liquid having grain size of 03 microns suitable for use in electrically operated lapping machine
Details As per Specification Sheet
| Item # | Title | Description | Quantity | Unit | Consignee | Delivery (Days) | Price Trends |
|---|---|---|---|---|---|---|---|
| 1 | 1. Cast iron plain Hand lapping plate -dia- 6 inch- 30 mm thick | Details As per Specification Sheet | 4 | no | con2.gj | 120 | |
| 2 | 2. Cast iron plain Hand lapping plate -dia- 12 inch- 30 mm thick | Details As per Specification Sheet | 3 | no | con2.gj | 120 | |
| 3 | 3. Cast iron plain Hand lapping plate -dia- 18 inch- 30 mm thick | Details As per Specification Sheet | 2 | no | con2.gj | 120 | |
| 4 | 4. Copper hand polishing plate mounted on MS base plate -dia- 6 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate | Details As per Specification Sheet | 4 | no | con2.gj | 120 | |
| 5 | 5. Copper hand polishing plate mounted on MS base plate -dia- 12 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate | Details As per Specification Sheet | 3 | no | con2.gj | 120 | |
| 6 | 6. Copper hand polishing plate mounted on MS base plate -dia- 18 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate | Details As per Specification Sheet | 2 | no | con2.gj | 120 | |
| 7 | 7. Diamond lapping compound having grades of grain size 10 microns and packing in 5 gms of syringe | Details As per Specification Sheet | 180 | no | con2.gj | 120 | |
| 8 | 8. Diamond lapping compound having grades of grain size 15 microns and packing in 5 gms of syringe | Details As per Specification Sheet | 150 | no | con2.gj | 120 | |
| 9 | 9. Diamond lapping compound having grades of grain size 25 microns and packing in 5 gms of syringe | Details As per Specification Sheet | 180 | no | con2.gj | 120 | |
| 10 | 10. Diamond lapping compound having grades of grain size 45 microns and packing in 5 gms of syringe | Details As per Specification Sheet | 180 | no | con2.gj | 120 | |
| 11 | 11. Diamond lapping compound having grades of grain size 70 microns and packing in 5 gms of syringe | Details As per Specification Sheet | 150 | no | con2.gj | 120 | |
| 12 | 12. Diamond lapping compound having grades of grain size 90 microns and packing in 5 gms of syringe | Details As per Specification Sheet | 150 | no | con2.gj | 120 | |
| 13 | 13. Lapping abrasive liquid having grain size of 03 microns suitable for use in electrically operated lapping machine | Details As per Specification Sheet | 200 | litter | con2.gj | 120 |
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Extended Deadline
27-Feb-2026, 2:00 pm
Opening Date
27-Feb-2026, 2:30 pm
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Main Document
OTHER
BOQ
BOQ
GEM_GENERAL_TERMS_AND_CONDITIONS