Hindustan Aeronautics Limited HAL Defence PCB Modules Tender 2026 - 3 PCB Categories, FR4, 22/16/2.4mm Specifications, 136.48 Cr

Tender Overview

Hindustan Aeronautics Limited (Department of Defence Production) invites bids for multiple high-layer FR4 printed circuit board assemblies: INPUT OUTPUT CONTROLLER MODULE PCB (DRG. NO. P-102F-A1-01-28-00, VER-6, 22 layers), DISCRETE INPUT OUTPUT MODULE PCB (16 layers, FR4, 2.4 mm thickness, size 160 × 233.3 mm), EMI FILTER PCB (Glass Epoxy-FR4, 2-layer, 134 × 100 × 2.4 mm), and CPCI BACK PLANE PCB (Ver 6.0, 24 layers, FR4 with flex-rigid). Estimated contract value is ₹136,478,317.50. Tender scope centers on advanced defence-grade PCBs with multi-layer FR4 substrates and mixed construction. The 50% quantity option clause and extended delivery provisions are aligned with standard GeM buy terms, enabling flexibility in order size and delivery windows. The tender emphasizes OEM/authorized distributor participation with single-bid restrictions per OEM. Location details are not specified; procurement is under HAL’s Defence Production mandate, targeting secure, aerospace-grade PCB assemblies. Key differentiator: multiple specialized PCB types under a single procurement with high-layer counts and mixed material configurations. Unique aspects include 6.0 version CPCI back planes and strict distributor authorization rules.

Technical Specifications & Requirements

• Product categories: INPUT OUTPUT CONTROLLER MODULE PCB, DISCRETE INPUT OUTPUT MODULE PCB, EMI FILTER PCB, CPCI BACK PLANE PCB
• Substrate: FR4 (Glass Epoxy), with variants including 22-layer, 16-layer, 2-layer EMI, and 24-layer back plane
• Dimensions/Thickness: 160 × 233.3 mm (16-layer module); EMI 134 × 100 × 2.4 mm; back plane 24-layer with Flex-Rigid configuration
• Versions/Drg numbers: P-102F-A1-01-28-00 (VER-6) for input-output controller; CPCI BACK PLANE VER 6.0
• Quantity flexibility: up to 50% more or less than bid quantity during contract; delivery extension logic defined (minimum 30 days)
• Standards/Compliance: not specified in data; bidders should assume standard HAL/s standards for defence PCBs and verify OEM authorizations
• Delivery terms: extension rules tied to original/extended delivery periods; delivery commence from last date of original order
• Bidder scope: India-based agent or OEM; authorized distributors must obtain OEM authority; no simultaneous bidding by same distributor for multiple OEMs in same tender
• Estimated value emphasis: indicates high-value, multi-item PCB framework contract with stringent quality controls

Terms, Conditions & Eligibility

• EMD/financial viability: not stated in data; bidders should prepare standard EMD as per GeM terms and HAL requirements
• Delivery timeline: delivery period utilities linked to order dates; option clause allows quantity-based extension with defined calculation
• Eligibility: India Agent or Principal/OEM permitted; separate authorization required for distributors; single bid per OEM per tender
• Delivery penalties: not specified; standard contract penalties and LDs may apply per HAL terms
• Documentation: OEM authorizations, GST, PAN, experience certificates, and financial statements typically required for defence PCB tenders
• Periodic updates: clause to adjust quantity and delivery within contracted rates; ensure compliance with supplier registration and defence procurement guidelines