Procurement Opportunity: Purchase of Compaction die as per the drawings for SOFC interconnect plate fabrication. in RANGA REDDY, TELANGANA
Bid Publish Date
03-Dec-2024, 9:00 am
Bid End Date
24-Dec-2024, 3:30 pm
EMD
₹9,000
Value
₹3,57,540
Location
Progress
Tender Type
Open
Contract Type
Tender
Tender Fee
₹590
EMD Exemption
Yes
Category
Miscellaneous Goods
Contract Form
Supply
Contract Period
30
Categories
10
The issuing authority announces a tender for Purchase of Compaction die as per the drawings for SOFC interconnect plate fabrication. in RANGA REDDY, TELANGANA. Submission Deadline: 24-12-2024 15: 30: 00. Last date to apply is approaching fast!
Additional Tender Data
Commercial Details
Tender Category
Goods
Payment Mode
Offline
EMD Payable To
DIRECTOR ARCI
Bid To RA
No
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Documents 1
ZIP_PACKAGE
Main Document
Technical Results
| S.No | Seller | Date | Status |
|---|---|---|---|
| 1 | Sai Chaitanya Engineering Works | 14-12-2024 15:21:00 |
Financial Results
| Rank | Seller | Price |
|---|---|---|
| L1 | Sai Chaitanya Engineering Works |
Result Documents 6
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Documents 1
ZIP_PACKAGE
Main Document