Phase 1 supply of MDP PCB, R105.19.1200-00, as per scope of work including NRE charges, SOW AS PER
Hindustan Aeronautics Limited (hal)
Rangareddi, TELANGANA
Bid Publish Date
29-Oct-2024, 3:32 pm
Bid End Date
25-Nov-2024, 4:00 pm
Progress
Quantity
34
Category
SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I
Bid Type
Two Packet Bid
Public procurement opportunity for Hindustan Aeronautics Limited (hal) SUPPLY OF BSC PCB BOARD R108. 30. 0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I, SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BSC PCB R108. 30. 0200 DETAILS AS PER THE ANNEXURE-I, NRE CHARGES FOR BSC PCB R108. 30. 0200 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS, NRE CHARGES FOR BSC PCB R108. 30. 0200 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS, SUPPLY OF BFM PCB BOARD R108. 30. 0300 ASSEMBLY DETAILS AS PER THE ANNEXURE-I, SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BFM PCB DETAILS AS PER THE ANNEXURE-I, NRE CHARGES FOR BFM PCB R108. 30. 0300 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS, NRE CHARGES FOR BFM PCB R108. 30. 0300 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS. Quantity: 34 issued by. Submission Deadline: 25-11-2024 16: 00: 00. View full details and respond.
Main Document
BOQ
BOQ
ATC
GEM_GENERAL_TERMS_AND_CONDITIONS
Hindustan Aeronautics Limited (hal)
Rangareddi, TELANGANA
Hindustan Aeronautics Limited (hal)
Rangareddi, TELANGANA
Hindustan Aeronautics Limited (hal)
Rangareddi, TELANGANA
Hindustan Aeronautics Limited (hal)
Rangareddi, TELANGANA
Research & Development Centre (materials Department)
FARIDABAD, HARYANA
Tender Results
Loading results...
| Item # | Title | Description | Quantity | Unit | Consignee | Delivery (Days) |
|---|---|---|---|---|---|---|
| 1 | SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I | SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I | 5 | pieces | [email protected] | 210 |
| 2 | SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BSC PCB R108.30.0200 DETAILS AS PER THE ANNEXURE-I | SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BSC PCB R108.30.0200 DETAILS AS PER THE ANNEXURE-I | 10 | pieces | [email protected] | 210 |
| 3 | NRE CHARGES FOR BSC PCB R108.30.0200 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS | NRE CHARGES FOR BSC PCB R108.30.0200 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS | 1 | pieces | [email protected] | 210 |
| 4 | NRE CHARGES FOR BSC PCB R108.30.0200 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS | NRE CHARGES FOR BSC PCB R108.30.0200 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS | 1 | pieces | [email protected] | 210 |
| 5 | SUPPLY OF BFM PCB BOARD R108.30.0300 ASSEMBLY DETAILS AS PER THE ANNEXURE-I | SUPPLY OF BFM PCB BOARD R108.30.0300 ASSEMBLY DETAILS AS PER THE ANNEXURE-I | 5 | pieces | [email protected] | 210 |
| 6 | SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BFM PCB DETAILS AS PER THE ANNEXURE-I | SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BFM PCB DETAILS AS PER THE ANNEXURE-I | 10 | pieces | [email protected] | 210 |
| 7 | NRE CHARGES FOR BFM PCB R108.30.0300 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS | NRE CHARGES FOR BFM PCB R108.30.0300 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS | 1 | pieces | [email protected] | 210 |
| 8 | NRE CHARGES FOR BFM PCB R108.30.0300 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS | NRE CHARGES FOR BFM PCB R108.30.0300 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS | 1 | pieces | [email protected] | 210 |
Additional Doc 1 (Requested in ATC)
Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria
the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer
Extended Deadline
25-Nov-2024, 4:00 pm
Opening Date
25-Nov-2024, 4:30 pm
| S.No | Seller | Item | Date | Status |
|---|---|---|---|---|
| 1 | ANUVEGA TECHNOLOGIES PRIVATE LIMITED Under PMA | - | 19-11-2024 15:19:39 | Qualified |
| 2 | APOLLO MICRO SYSTEMS LIMITED Under PMA | - | 23-11-2024 13:50:05 | Qualified |
| 3 | ARGUS EMBEDDED SYSTEMS PRIVATE LIMITED Under PMA | - | 19-11-2024 12:07:08 | Qualified |
| 4 | ELECTRO CIRCUIT SYSTEMS Under PMA | - | 23-11-2024 12:14:12 | Qualified |
| 5 | RELIABLE TECHNOSYSTEMS INDIA PRIVATE LIMITED Under PMA | - | 15-11-2024 15:51:14 | Qualified |
| 6 | SMART-WAVES TECHNOLOGIES PRIVATE LIMITED Under PMA | - | 19-11-2024 15:05:19 | Qualified |
| Rank | Seller | Price | Item |
|---|---|---|---|
| Disqualified | ELECTRO CIRCUIT SYSTEMS (MSE,MII) Under PMA | ₹14,95,250 | Item Categories : SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I,SUPPLY OF SPARE COMPONE |
| L1 | SMART-WAVES TECHNOLOGIES PRIVATE LIMITED(MSE,MII)( MSE Social Category:SC ) Under PMA | ₹32,06,657 | Item Categories : SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I,SUPPLY OF SPARE COMPONE |
| L2 | APOLLO MICRO SYSTEMS LIMITED (MSE,MII)( MSE Social Category:General ) Under PMA | ₹37,77,756 | Item Categories : SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I,SUPPLY OF SPARE COMPONE |
| L3 | ARGUS EMBEDDED SYSTEMS PRIVATE LIMITED (MSE,MII)( MSE Social Category:General ) Under PMA | ₹50,83,740 | Item Categories : SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I,SUPPLY OF SPARE COMPONE |
| L4 | ANUVEGA TECHNOLOGIES PRIVATE LIMITED (MSE,MII)( MSE Social Category:General ) Under PMA | ₹57,84,759 | Item Categories : SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I,SUPPLY OF SPARE COMPONE |
| L5 | RELIABLE TECHNOSYSTEMS INDIA PRIVATE LIMITED (MSE,MII)( MSE Social Category:General ) Under PMA | ₹1,59,00,000 | Item Categories : SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I,SUPPLY OF SPARE COMPONE |
The eligibility requirements include being a registered entity, holding relevant industry certifications, and demonstrating experience in delivering similar PCB products. Documentation may be required to support claims of financial stability and prior operational history.
Bidders must provide certifications such as ISO quality standards, relevant industry licenses, and any additional certifications pertinent to electronic manufacturing processes. Documentation that verifies compliance with local regulations may also be required.
To register for this tender, visit the designated tender submission portal and complete the required registration forms. Make sure to provide the necessary documents that affirm your eligibility and expertise in PCB manufacturing.
Accepted document formats for submissions generally include PDF for comprehensive documents, Excel for financial statements, and any standard formats specified in the tender documentation. Always adhere to any specific requirements provided.
Technical specifications include detailed layout designs, Gerber files, and requirements for conducting SI, PI, and thermal analyses. Compliance with these specifications is crucial for successful bid evaluation.
Bidders must meet established industry quality standards, which may include ISO and IPC standards for PCB manufacturing. Detailed quality assurance and testing protocols should accompany all submissions.
Yes, compliance requirements include adherence to industry standards, local manufacturing regulations, and any specific conditions outlined in the tender documentation. Proof of compliance must be documented.
Testing criteria should include functional testing, electrical performance verification, and thermal performance assessments to ensure the delivered products meet operational standards. Certifications from recognized testing centers may enhance your submission.
The Earnest Money Deposit (EMD) is required as a demonstration of the bidder's commitment to the tender process. The specific amount will be detailed in the tender documents and must be submitted as a part of the bid.
Bid submissions must include a performance security that typically takes the form of a bank guarantee, covering a percentage of the contract value. This ensures the bidder's accountability throughout the execution of the tender.
The payment terms for this tender will be stated in the submissions and will likely outline payment schedules aligned with project milestones, including upfront payments, progress payments based on deliverables, and final settlement upon project completion.
Price evaluation considerations will focus on the total cost presented in each bid, with emphasis on the value offered against the required deliverables, and adherence to technical specifications. Additionally, competitive pricing strategies may play a crucial role.
Bids must be submitted electronically through the designated tender submission portal. Ensure that all documents are uploaded correctly in the required format to avoid disqualification.
Key timelines and deadlines will be outlined in the tender documentation. It is crucial to review all dates for submission and opening of bids to ensure timely and compliant participation in the tender process.
The evaluation and selection process will involve technical assessment based on specifications, financial review, and overall value offered by each tender submission. Bidder presentations may also be considered in some cases.
Results of the tender evaluation will be communicated to all participants upon completion of the evaluation process. Bidders should ensure they provide accurate contact information for notification purposes.
Yes, the tender includes specific provisions beneficial to Micro, Small, and Medium Enterprises (MSEs) and startups. These may include relaxed eligibility criteria and additional support aimed at encouraging participation from emerging businesses.
This tender promotes local manufacturing and sourcing by encouraging participation from domestic firms, thereby contributing to the 'Make in India' initiative. Bidders must ensure alignment with local content requirements and procurement rules.
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Main Document
BOQ
BOQ
ATC
GEM_GENERAL_TERMS_AND_CONDITIONS