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Invitation to Bid - SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I,SUPPLY OF SPARE COMPONE

Bid Publish Date

29-Oct-2024, 3:32 pm

Bid End Date

25-Nov-2024, 4:00 pm

Latest Corrigendum Available

Progress

Issue29-Oct-2024, 3:32 pm
Technical19-11-2024 15:19:39
Financial
AwardPending
Explore all 4 tabs to view complete tender details

Quantity

34

Category

SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I

Bid Type

Two Packet Bid

Categories 9

Public procurement opportunity for Hindustan Aeronautics Limited (hal) SUPPLY OF BSC PCB BOARD R108. 30. 0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I, SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BSC PCB R108. 30. 0200 DETAILS AS PER THE ANNEXURE-I, NRE CHARGES FOR BSC PCB R108. 30. 0200 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS, NRE CHARGES FOR BSC PCB R108. 30. 0200 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS, SUPPLY OF BFM PCB BOARD R108. 30. 0300 ASSEMBLY DETAILS AS PER THE ANNEXURE-I, SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BFM PCB DETAILS AS PER THE ANNEXURE-I, NRE CHARGES FOR BFM PCB R108. 30. 0300 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS, NRE CHARGES FOR BFM PCB R108. 30. 0300 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS. Quantity: 34 issued by. Submission Deadline: 25-11-2024 16: 00: 00. View full details and respond.

Documents 5

GeM-Bidding-7083472.pdf

Main Document

BOQ Document

BOQ

BOQ Document

BOQ

Buyer uploaded ATC document

ATC

GEM General Terms and Conditions Document

GEM_GENERAL_TERMS_AND_CONDITIONS

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Bill of Quantities (BOQ) 8 Items

Item # Title Description Quantity Unit Consignee Delivery (Days)
1 SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I 5 pieces [email protected] 210
2 SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BSC PCB R108.30.0200 DETAILS AS PER THE ANNEXURE-I SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BSC PCB R108.30.0200 DETAILS AS PER THE ANNEXURE-I 10 pieces [email protected] 210
3 NRE CHARGES FOR BSC PCB R108.30.0200 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS NRE CHARGES FOR BSC PCB R108.30.0200 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS 1 pieces [email protected] 210
4 NRE CHARGES FOR BSC PCB R108.30.0200 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS NRE CHARGES FOR BSC PCB R108.30.0200 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS 1 pieces [email protected] 210
5 SUPPLY OF BFM PCB BOARD R108.30.0300 ASSEMBLY DETAILS AS PER THE ANNEXURE-I SUPPLY OF BFM PCB BOARD R108.30.0300 ASSEMBLY DETAILS AS PER THE ANNEXURE-I 5 pieces [email protected] 210
6 SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BFM PCB DETAILS AS PER THE ANNEXURE-I SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BFM PCB DETAILS AS PER THE ANNEXURE-I 10 pieces [email protected] 210
7 NRE CHARGES FOR BFM PCB R108.30.0300 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS NRE CHARGES FOR BFM PCB R108.30.0300 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS 1 pieces [email protected] 210
8 NRE CHARGES FOR BFM PCB R108.30.0300 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS NRE CHARGES FOR BFM PCB R108.30.0300 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS 1 pieces [email protected] 210

Required Documents

1

Additional Doc 1 (Requested in ATC)

2

Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria

3

the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer

Corrigendum Updates

1 Update
#1

Update

21-Nov-2024

Extended Deadline

25-Nov-2024, 4:00 pm

Opening Date

25-Nov-2024, 4:30 pm

Technical Results

S.No Seller Item Date Status
1ANUVEGA TECHNOLOGIES PRIVATE LIMITED   Under PMA-19-11-2024 15:19:39Qualified
2APOLLO MICRO SYSTEMS LIMITED   Under PMA-23-11-2024 13:50:05Qualified
3ARGUS EMBEDDED SYSTEMS PRIVATE LIMITED   Under PMA-19-11-2024 12:07:08Qualified
4ELECTRO CIRCUIT SYSTEMS   Under PMA-23-11-2024 12:14:12Qualified
5RELIABLE TECHNOSYSTEMS INDIA PRIVATE LIMITED   Under PMA-15-11-2024 15:51:14Qualified
6SMART-WAVES TECHNOLOGIES PRIVATE LIMITED   Under PMA-19-11-2024 15:05:19Qualified

Financial Results

Rank Seller Price Item
DisqualifiedELECTRO CIRCUIT SYSTEMS (MSE,MII)   Under PMA₹14,95,250Item Categories : SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I,SUPPLY OF SPARE COMPONE
L1SMART-WAVES TECHNOLOGIES PRIVATE LIMITED(MSE,MII)( MSE Social Category:SC )    Under PMA₹32,06,657Item Categories : SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I,SUPPLY OF SPARE COMPONE
L2APOLLO MICRO SYSTEMS LIMITED (MSE,MII)( MSE Social Category:General )    Under PMA₹37,77,756Item Categories : SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I,SUPPLY OF SPARE COMPONE
L3ARGUS EMBEDDED SYSTEMS PRIVATE LIMITED (MSE,MII)( MSE Social Category:General )    Under PMA₹50,83,740Item Categories : SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I,SUPPLY OF SPARE COMPONE
L4ANUVEGA TECHNOLOGIES PRIVATE LIMITED (MSE,MII)( MSE Social Category:General )    Under PMA₹57,84,759Item Categories : SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I,SUPPLY OF SPARE COMPONE
L5RELIABLE TECHNOSYSTEMS INDIA PRIVATE LIMITED (MSE,MII)( MSE Social Category:General )    Under PMA₹1,59,00,000Item Categories : SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I,SUPPLY OF SPARE COMPONE

Frequently Asked Questions

## FAQs
What are the eligibility requirements for this tender?

The eligibility requirements include being a registered entity, holding relevant industry certifications, and demonstrating experience in delivering similar PCB products. Documentation may be required to support claims of financial stability and prior operational history.

What certificates are required for submission?

Bidders must provide certifications such as ISO quality standards, relevant industry licenses, and any additional certifications pertinent to electronic manufacturing processes. Documentation that verifies compliance with local regulations may also be required.

How do I register for this tender?

To register for this tender, visit the designated tender submission portal and complete the required registration forms. Make sure to provide the necessary documents that affirm your eligibility and expertise in PCB manufacturing.

What document formats are accepted for submission?

Accepted document formats for submissions generally include PDF for comprehensive documents, Excel for financial statements, and any standard formats specified in the tender documentation. Always adhere to any specific requirements provided.

What are the technical specifications required for the PCBs?

Technical specifications include detailed layout designs, Gerber files, and requirements for conducting SI, PI, and thermal analyses. Compliance with these specifications is crucial for successful bid evaluation.

What quality standards must be adhered to?

Bidders must meet established industry quality standards, which may include ISO and IPC standards for PCB manufacturing. Detailed quality assurance and testing protocols should accompany all submissions.

Are there compliance requirements for this tender?

Yes, compliance requirements include adherence to industry standards, local manufacturing regulations, and any specific conditions outlined in the tender documentation. Proof of compliance must be documented.

What are the testing criteria for the PCB assemblies?

Testing criteria should include functional testing, electrical performance verification, and thermal performance assessments to ensure the delivered products meet operational standards. Certifications from recognized testing centers may enhance your submission.

Can you explain the Earnest Money Deposit (EMD) details?

The Earnest Money Deposit (EMD) is required as a demonstration of the bidder's commitment to the tender process. The specific amount will be detailed in the tender documents and must be submitted as a part of the bid.

What are the performance security requirements?

Bid submissions must include a performance security that typically takes the form of a bank guarantee, covering a percentage of the contract value. This ensures the bidder's accountability throughout the execution of the tender.

What are the payment terms for this tender?

The payment terms for this tender will be stated in the submissions and will likely outline payment schedules aligned with project milestones, including upfront payments, progress payments based on deliverables, and final settlement upon project completion.

How will price evaluation be conducted?

Price evaluation considerations will focus on the total cost presented in each bid, with emphasis on the value offered against the required deliverables, and adherence to technical specifications. Additionally, competitive pricing strategies may play a crucial role.

What submission methods are acceptable for bids?

Bids must be submitted electronically through the designated tender submission portal. Ensure that all documents are uploaded correctly in the required format to avoid disqualification.

What are the key timelines and deadlines for tender submission?

Key timelines and deadlines will be outlined in the tender documentation. It is crucial to review all dates for submission and opening of bids to ensure timely and compliant participation in the tender process.

How will the evaluation and selection process be conducted?

The evaluation and selection process will involve technical assessment based on specifications, financial review, and overall value offered by each tender submission. Bidder presentations may also be considered in some cases.

When will results be communicated to bidders?

Results of the tender evaluation will be communicated to all participants upon completion of the evaluation process. Bidders should ensure they provide accurate contact information for notification purposes.

Are there benefits for MSEs and startups in this tender?

Yes, the tender includes specific provisions beneficial to Micro, Small, and Medium Enterprises (MSEs) and startups. These may include relaxed eligibility criteria and additional support aimed at encouraging participation from emerging businesses.

How does this tender comply with 'Make in India' policies?

This tender promotes local manufacturing and sourcing by encouraging participation from domestic firms, thereby contributing to the 'Make in India' initiative. Bidders must ensure alignment with local content requirements and procurement rules.