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Procurement Opportunity: AUDIO PCB FABRICATION (C108.03. 0700-00) AND GROUP B DETAILS AS PER THE ANNEXURE-1,CONNECTOR PANEL in Rangareddi, TELANGANA

Bid Publish Date

03-Feb-2026, 5:22 pm

Bid End Date

13-Feb-2026, 6:00 pm

Progress

Issue03-Feb-2026, 5:22 pm
AwardPending
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Quantity

28

Category

AUDIO PCB FABRICATION (C108.03. 0700-00) AND GROUP B DETAILS AS PER THE ANNEXURE-1

Bid Type

Single Packet Bid

Categories 8

Hindustan Aeronautics Limited (hal) announces a tender for AUDIO PCB FABRICATION (C108. 03. 0700-00) AND GROUP B DETAILS AS PER THE ANNEXURE-1, CONNECTOR PANEL PCB FABRICATION (C108. 03. 0200-00) DETAILS AS PER THE ANNEXURE-1, MOTHER BOARD PCB FABRICATION (C108. 03. 0300-00) DETAILS AS PER THE ANNEXURE-1, POWER SUPPLY PCB FABRICATION (C108. 03. 0600-00) DETAILS AS PER THE ANNEXURE-1 in Rangareddi, TELANGANA. Quantity: 28. Submission Deadline: 13-02-2026 18: 00: 00. Last date to apply is approaching fast!

Documents 7

GeM-Bidding-8925539.pdf

Main Document

Buyer uploaded ATC document

ATC

Buyer uploaded ATC document

ATC

Buyer uploaded ATC document

ATC

Buyer uploaded ATC document

ATC

Buyer uploaded ATC document

ATC

GEM General Terms and Conditions Document

GEM_GENERAL_TERMS_AND_CONDITIONS

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Required Documents

1

Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria

2

the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer

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