Contract Bidding Open For Wirebond removal for BGA packaged semiconductor chips in THIRUVANANTHAPURAM, KERALA
Bid Publish Date
19-Aug-2026, 2:34 pm
Bid End Date
01-Sep-2026, 3:00 pm
Location
Progress
Public procurement opportunity for Centre For Development Of Advanced Computing (c-dac) Wirebond removal for BGA packaged semiconductor chips in THIRUVANANTHAPURAM, KERALA. Quantity: 1 issued by. Submission Deadline: 01-09-2026 15: 00: 00. View full details and respond.
Tender Data
Bid Details
Quantity
1
Bid Type
Two Packet Bid
Bid Validity
90 (Days)
Bid Type
Service
Evaluation
Total value wise evaluation
Inspection Required
No
Tech Clarification Time
2 Days
Preference & Exemptions
EMD Required
No
MII Purchase Preference
Yes
MII Preference Band
L1+20%
MSE Purchase Preference
Yes
MSE Preference Band
L1+15%
MSE Exemption/Relaxation
Yes
Startup Exemption/Relaxation
Yes
Bid Splitting Applied
No
Requirements
Arbitration Clause
No
Mediation Clause
No
Additional Tender Data
Commercial Details
Tender Category
Goods
Bid To RA
No
Bid To RA Enabled
No
Item Category
Wirebond removal for BGA packaged semiconductor chips
Delivery Details
Max Delivery Days
30
Delivery Locations
1
Delivery Cities
Thiruvananthapuram
Delivery Pincodes
695033
Delivery Locations
| Consignee | Address | City | State | Pincode | Quantity | Delivery Days | Additional Requirement |
|---|---|---|---|---|---|---|---|
| Dhanya S | 695033,Purchase Department, Centre for Development of Advanced Computing, Vellayambalam | Thiruvananthapuram | Kerala | 695033 | 1 | 30 | - |
Authority Records
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Documents 3
GeM-Bidding-9777441.pdf
Main Document
Other Documents
OTHER
GEM General Terms and Conditions Document
GEM_GENERAL_TERMS_AND_CONDITIONS
Categories
1
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