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Contract Bidding Open For Automatic Wafer Dicing Machine in CENTRAL, DELHI

Bid Publish Date

04-Dec-2025, 5:00 pm

Bid End Date

21-Jan-2026, 2:00 pm

EMD

₹9,00,000

Location

CENTRAL , DELHI
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Progress

Issue04-Dec-2025, 5:00 pm
Technical20-01-2026 21:48:00
AwardPending
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Tender Type

Global Tenders

Contract Type

Tender

Tender Fee

₹0

EMD Exemption

Yes

Category

Miscellaneous Goods

Contract Form

Supply

Contract Period

120

Categories 2

MACHINE VEGETABLES FRUITS CUTTING MACHINERY

Department of Defence Research and Development has released a public tender for Automatic Wafer Dicing Machine in CENTRAL, DELHI. Submission Deadline: 21-01-2026 14: 00: 00. Download documents and apply online.

Additional Tender Data

Commercial Details

Tender Category

Goods

Payment Mode

Offline

EMD Payable To

DIRECTOR, SSPL

Bid To RA

No

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Documents 1

Download as zip file

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Invitation to Bid - InP Wafer in CENTRAL, DELHI

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Posted: 27 January 2026
Closed: 5 March 2026
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Contract Bidding Open For Fabrication Support Service for Development of PIC Component (Batch of 4 Wafer) in CENTRAL, DELHI

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Posted: 19 January 2026
Closed: 4 February 2026
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Wafer Dicing Equipment

National Institute Of Technical Teachers Training And Research (nitttrs)

BHOPAL, MADHYA PRADESH

Posted: 26 December 2024
Closed: 16 January 2025
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Microprocessor Controlled Automatic Injection Moulding Machine (80Tons)

N/A

PATNA, BIHAR

Posted: 6 June 2025
Closed: 30 June 2025
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On Wafer Measurement System

Society For Applied Microwave Electronic Engineering And Research (sameer)

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Posted: 28 March 2025
Closed: 5 May 2025
GEM

Technical Results

S.No Seller Date Status
1
EDGE TECH SCIENTIFIC PVT LTD
20-01-2026 21:48:00
2
Global Marketing Services
01-01-2026 18:45:00
3
TESSCORN SYSTEMS INDIA PRIVATE LIMITED
21-01-2026 08:59:00

Result Documents 1

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Result Page

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