Bid Publish Date
12-Aug-2025, 4:40 pm
Bid End Date
09-Sep-2025, 5:00 pm
Location
Progress
Quantity
455
Category
GC201300-013, BLANK PCB GLASS EPOXY FR4 MICROPACK LTD.
Bid Type
Single Packet Bid
Hindustan Aeronautics Limited (hal) invites bids for GC201300-013, BLANK PCB GLASS EPOXY FR4 MICROPACK LTD. , GC203001-053-VER: 01, GLASS EPOXY MULTILAYER FR4 PCB SIZE: 180 X 116 X 1. 6 MM, 06 LAYERS, MIL-PRF- 5511, GC204001-053-VER: 01, GLASS EPOXY MULTI- LAYER(08 LAYERS) FR4 PCB, SIZE: 180MM X 116MM X 1. 6MM, MIL-PRF, GC205001-053-VER: 01, GLASS EPOXY MULTI-LAYER FR4 PCB Blank (04Layer) Size: 170 X 116 X 1. 6 MM; MIL-P, GC206001-053-VER: 01, GLASS EPOXY MULTI-LAYER FR4 PCB BLANK(6-Layer) Size: 170 X 116 X 1. 6 MM, MIL-PR, GC207001-053-VER: 01, Glass Epoxy Multi- layer FR4 PCB Blank (8 Layer), Size: 170 X 116 X 1. 6 MM, mil, GC208001-053-VER: 01, MULTI LAYER RIGID GLASS EPOXY FR4 PCB, Size: 82 X 37 X 2. 4 mm, 02 layers, MIL-PR, FC000300-02, Glass epoxy multilayer Glass epoxy multilayer FR4 PCB Size: 124± 0. 5mm X 116± 0. 5mmX 1. 6± 0, FC000400-02, Bare PCB MICROPACK LTD. in SULTANPUR, UTTAR PRADESH. Quantity: 455. Submission Deadline: 09-09-2025 17: 00: 00. Submit your proposal before the deadline.
Tender Category
Goods
Bid To RA
No
Bid To RA Enabled
No
Item Category
GC201300-013, BLANK PCB GLASS EPOXY FR4 MICROPACK LTD. , GC203001-053-VER: 01, GLASS EPOXY MULTILAYER FR4 PCB SIZE: 180 X 116 X 1.6 MM, 06 LAYERS, MIL-PRF- 5511 , GC204001-053-VER: 01, GLASS EPOXY MULTI- LAYER(08 LAYERS) FR4 PCB, SIZE: 180MM X 116MM X 1.6MM, MIL-PRF , GC205001-053-VER: 01, GLASS EPOXY MULTI-LAYER FR4 PCB Blank (04Layer) Size: 170 X 116 X 1.6 MM; MIL-P , GC206001-053-VER: 01, GLASS EPOXY MULTI-LAYER FR4 PCB BLANK(6-Layer) Size: 170 X 116 X 1.6 MM, MIL-PR , GC207001-053-VER: 01, Glass Epoxy Multi- layer FR4 PCB Blank (8 Layer) , Size: 170 X 116 X 1.6 MM, mil , GC208001-053-VER: 01, MULTI LAYER RIGID GLASS EPOXY FR4 PCB, Size: 82 X 37 X 2.4 mm, 02 layers, MIL-PR , FC000300-02, Glass epoxy multilayer Glass epoxy multilayer FR4 PCB Size: 124± 0.5mm X 116± 0.5mmX 1.6± 0 , FC000400-02, Bare PCB MICROPACK LTD.
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Main Document
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ATC
GEM_GENERAL_TERMS_AND_CONDITIONS
Discover companies most likely to bid on this tender
Certificate (Requested in ATC)
OEM Authorization Certificate
Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria
the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer
Extended Deadline
09-Sep-2025, 5:00 pm
Opening Date
09-Sep-2025, 5:30 pm
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Main Document
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ATC
GEM_GENERAL_TERMS_AND_CONDITIONS