Government Tender Published for Lan Connectors,Lan Wire,Power cable,RAM DDR 3,Thermal Compound Paste Use in Coolers Heat Sink for C in MUMBAI, MAHARASHTRA
Bid Publish Date
19-Aug-2026, 4:07 pm
Bid End Date
01-Sep-2026, 5:00 pm
Location
Progress
Ai Airport Services Limited announces a tender for Lan Connectors, Lan Wire, Power cable, RAM DDR 3, Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets in MUMBAI, MAHARASHTRA. Quantity: 545. Submission Deadline: 01-09-2026 17: 00: 00. Last date to apply is approaching fast!
Tender Data
Bid Details
Quantity
545
Category
Lan Connectors
Bid Type
Two Packet Bid
Bid Validity
120 (Days)
Bid Type
Service
Evaluation
Item wise evaluation
Inspection Required
No
Tech Clarification Time
2 Days
Preference & Exemptions
EMD Required
No
MII Purchase Preference
No
MSE Purchase Preference
Yes
MSE Preference Band
L1+15%
MSE Exemption/Relaxation
Yes
Startup Exemption/Relaxation
Yes
Bid Splitting Applied
No
Requirements
Past Performance
30 %
Arbitration Clause
No
Mediation Clause
No
Additional Tender Data
Commercial Details
Tender Category
Goods
Bid To RA
No
Bid To RA Enabled
No
Item Category
Lan Connectors , Lan Wire , Power cable , RAM DDR 3 , Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets
Payment Timelines
Payments shall be made to the Seller within 45 days of issue of consignee receipt-cum-acceptance certificate (CRAC) and on-line submission of bills (This is in supersession of 10 days time as provided in clause 12 of GeM GTC)
Delivery Details
Max Delivery Days
30
Delivery Locations
1
Delivery Cities
Mumbai Suburban
Delivery Pincodes
400099
Delivery Locations
| Consignee | Address | City | State | Pincode | Quantity | Delivery Days | Additional Requirement |
|---|---|---|---|---|---|---|---|
| Chandrakant Rajaram Zende | 400099,GSD Complex, Near Gate No. 5, Sahar, Andheri (East), Mumbai 99. | Mumbai Suburban | Maharashtra | 400099 | 200 | 30 | - |
Authority Records
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Documents 5
GeM-Bidding-9778455.pdf
Main Document
BOQ Document
BOQ
BOQ Document
BOQ
Buyer uploaded ATC document
ATC
GEM General Terms and Conditions Document
GEM_GENERAL_TERMS_AND_CONDITIONS
Corrigendum Updates
1 Update Update
Extended Deadline
01-Sep-2026, 11:30 am
Opening Date
01-Sep-2026, 12:00 pm
Bill of Quantities (BOQ)
5 Items Sign in to view GEM price trends Sign in for GEM prices
Lan Connectors
Digisol Dlink
Lan Wire
Digisol Dlink
Power cable
Any Brand product approved with the ISI mark
RAM DDR 3
Any Brand product approved with the ISI mark with 1 Yr Warranty
Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets
Any Brand product approved with the ISI mark
| Item # | Title | Description | Quantity | Unit | Consignee | Delivery (Days) | Price Trends |
|---|---|---|---|---|---|---|---|
| 1 | Lan Connectors | Digisol Dlink | 200 | each | bom.stores | 30 | |
| 2 | Lan Wire | Digisol Dlink | 305 | mtr | bom.stores | 30 | |
| 3 | Power cable | Any Brand product approved with the ISI mark | 30 | each | bom.stores | 30 | |
| 4 | RAM DDR 3 | Any Brand product approved with the ISI mark with 1 Yr Warranty | 8 | each | bom.stores | 30 | |
| 5 | Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets | Any Brand product approved with the ISI mark | 2 | each | bom.stores | 30 |
Categories
12
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Required Documents
Experience Criteria
Past Performance
Certificate (Requested in ATC)
Additional Doc 1 (Requested in ATC)
Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria
the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer