TenderDekho Logo
GEM

Government Tender Published for Ubimote 2v3 - PCB Manufacturing,Ubimote 2v3 - Electronic Components,Ubimote 2v3 - Assembly,Ubisense in BANGALORE, KARNATAKA

Bid Publish Date

22-Apr-2025, 5:14 pm

Bid End Date

13-May-2025, 6:00 pm

Progress

Issue22-Apr-2025, 5:14 pm
Technical05-Dec-2025, 1:41 pm
Award31-Jul-2025, 1:43 am
Explore all 5 tabs to view complete tender details

Quantity

1800

Bid Type

Two Packet Bid

Categories 1

Centre For Development Of Advanced Computing (c-dac) announces a tender for Ubimote 2v3 - PCB Manufacturing, Ubimote 2v3 - Electronic Components, Ubimote 2v3 - Assembly, Ubisense 1V2 - PCB Manufacturing, Ubisense 1V2 - Electronic Components, Ubisense 1V2 - Assembly in BANGALORE, KARNATAKA. Quantity: 1800. Submission Deadline: 13-05-2025 18: 00: 00. Last date to apply is approaching fast!

Documents 6

GeM-Bidding-7749294.pdf

Main Document

BOQ Document

BOQ

BOQ Document

BOQ

BOQ Document

BOQ

Buyer uploaded ATC document

ATC

GEM General Terms and Conditions Document

GEM_GENERAL_TERMS_AND_CONDITIONS

Past Similar Tenders (Historical Results)

5 found

Drone Components,Drone Components,Drone Components,Drone Components,Drone Components,Drone Componen

Indian Army

BHOPAL, MADHYA PRADESH

Posted: 8 August 2025
Closed: 25 August 2025
GEM

Drone Components,Drone Components,Drone Components,Drone Components,Drone Components,Drone Componen

Indian Army

BHOPAL, MADHYA PRADESH

Posted: 23 July 2025
Closed: 2 August 2025
GEM

Assembly filter element,Poly V Belt 1170,Assembly caliper brake,Air Filter Tata Sumo,Armature assem

Indian Army

Posted: 23 October 2024
Closed: 13 November 2024
GEM

Assembly Sealing Mould LH,Assembly Sealing Mould RH,Hose Inlet Joint,Bearing,Repair Kit Main Cylind

Controller General Of Defence Accounts

BIKANER, RAJASTHAN

Posted: 25 September 2025
Closed: 6 October 2025
GEM

NOTICE BOARD,SLIDE CHANGED POWER POINT PRESENTATION,SATELLITE LIBRARY,MANUFACTURING OF DISPLAY BOAR

Indian Navy

VISAKHAPATNAM, ANDHRA PRADESH

Posted: 4 February 2025
Closed: 25 February 2025
GEM

Bill of Quantities (BOQ) 6 Items

Item # Title Description Quantity Unit Consignee Delivery (Days)
1 Ubimote 2v3 - PCB Manufacturing Ubimote 2v3 300 numbers kjayashree 45
2 Ubimote 2v3 - Electronic Components Electronic Components for Ubimote 2V3 300 numbers kjayashree 45
3 Ubimote 2v3 - Assembly Assembly of Electronic components Ubimote 2V3 300 numbers kjayashree 45
4 Ubisense 1V2 - PCB Manufacturing Ubisense 1V2 300 numbers kjayashree 45
5 Ubisense 1V2 - Electronic Components Electronic Components for Ubisense 1V2 300 numbers kjayashree 45
6 Ubisense 1V2 - Assembly Assembly of Electronic compoents Ubisense 1V2 300 numbers kjayashree 45

Required Documents

1

Experience Criteria

2

Past Performance

3

Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria

4

the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer

Technical Results

S.No Seller Item Date Status
1CHIPRIME SEMICONDUCTOR PRIVATE LIMITED   Under PMA-12-05-2025 13:41:35Evaluated
2ELECTRO CIRCUIT SYSTEMS   Under PMA-13-05-2025 17:25:37Evaluated
3GURU KRIPA SOLUTIONS   Under PMA-12-05-2025 19:02:29Evaluated
4KARNATAKA HYBRID MICRO DEVICES LIMITED.   Under PMA-13-05-2025 13:50:37Evaluated
5TACHLOG PRIVATE LIMITED   Under PMA-13-05-2025 17:57:54Evaluated

Contract / Result Documents 1

Please sign in or create an account to view contract details and download result documents.

Frequently Asked Questions

Key insights about KARNATAKA tender market

What are the eligibility requirements for participation in the PCB manufacturing tender?

The eligibility requirements include being a registered entity with relevant experience in PCB manufacturing and assembly. Bidders must provide necessary certifications that validate compliance with technical standards and quality requirements as set by the Ministry of Electronics and Information Technology.

What certificates are required for this tender submission?

Vendors must submit relevant certifications that demonstrate their compliance with quality and technical specifications outlined in the tender documents. These certifications typically include proof of preceding quality management systems, manufacturing capabilities, and adherence to international standards.

How is the Earnest Money Deposit (EMD) structured for this tender?

The Earnest Money Deposit (EMD) acts as a security against the bid submission and varies based on the total value of the tender. Specific EMD details will be specified in the tender documents, outlining necessary amounts and submission processes to ensure compliance and bid validity.

What are the submission methods for the PCB components procurement tender?

Tender submissions must be carried out electronically, adhering to specified formats in the tender documents. Required documents include technical and financial proposals, and each document must meet the stipulated submission guidelines to ensure completeness and correctness.

Are there benefits for Micro, Small, and Medium Enterprises (MSEs) under this tender?

Yes, the tender includes provisions that benefit Micro, Small, and Medium Enterprises (MSEs) by encouraging their participation and providing support measures aimed at enhancing local production. Compliance with 'Make in India' initiatives will also be prioritized to support domestic manufacturers.