Progress
Quantity
2
Bid Type
Two Packet Bid
Hindustan Aeronautics Limited invites bids for a Temperature control panel intended for a Teflon Bonding unit at HAL, Bangalore, Karnataka. The scope includes supply, installation, testing, commissioning, and operator training, with statutory clearance as needed. The tender emphasizes flexible quantity adjustments up to 25%, and delivery timelines linked to the original order’s end date. Demurrage and packing guidelines are specified, and bidder documentation for vendor code creation includes PAN, GSTIN, cancelled cheque, EFT mandate. This procurement centers on precise control hardware for high-precision bonding processes, with emphasis on timely delivery and compliance with ATC packing and demurrage terms. Unique aspects include the option-based delivery extension and clear demurrage penalties for non-compliance, underscoring stringent on-site logistics.
Product/service: Temperature control panel
Application: Teflon Bonding unit
Location: Bangalore, Karnataka
Scope: Supply, Installation, Testing, Commissioning, Operator Training
Packaging: Original packing; standardized weights; net weight counted
Option Clause allowing ±25% quantity change
Delivery period tied to original delivery order date
Demurrage charges and item destruction policy for non-lifted items
Not specified in data; bidder should verify HAL ATC terms during bid submission
Delivery period commences from last date of original delivery order; extended time calculated by (Increased quantity / Original quantity) × Original delivery period, min 30 days
Demurrage 0.5% of total contract value per day for unlifted items after 48 hours; destruction after one month
Ability to supply temperature control panels for high-precision bonding units
Compliance with HAL/vendor code creation documentation
Capability to provide installation, testing, commissioning, and operator training
Tender Category
Goods
Bid To RA
No
Bid To RA Enabled
Yes
Item Category
Temperature control panel for Teflon Bonding unit
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Main Document
TECHNICAL
ATC
GEM_GENERAL_TERMS_AND_CONDITIONS
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PAN Card copy
GSTIN copy
Cancelled Cheque copy
EFT Mandate certified by Bank
Any prior experience certificates (if available)
Technical bid documentation/Compliance certificates (if any)
OEM authorizations (if applicable)
Extended Deadline
14-Apr-2026, 2:00 pm
Opening Date
14-Apr-2026, 2:30 pm
Extended Deadline
07-Apr-2026, 2:00 pm
Opening Date
07-Apr-2026, 2:30 pm
Key insights about KARNATAKA tender market
Bidders must prepare PAN, GSTIN, cancelled cheque, and EFT Mandate, along with standard bid documents. Ensure supply, installation, testing, commissioning, and operator training are covered, with compliance to ATC terms. Confirm delivery timelines based on original delivery order and account for 25% quantity variation.
Submit PAN, GSTIN, cancelled cheque, and bank-certified EFT Mandate. Include any prior experience certificates and OEM authorizations if applicable. Ensure technical bid documents demonstrate capability for supply, installation, testing, commissioning, and training for the Teflon Bonding unit control panel.
Delivery begins from the last date of the original delivery order. If quantity increases by up to 25%, the extended delivery period is calculated as (Increased quantity / Original quantity) × Original delivery period, with a minimum of 30 days.
Demurrage is 0.5% of the total contract value per day after 48 hours. If items remain unlifted for a month, they may be destroyed by HAL with no claim admitted.
Scope includes Supply, Installation, Testing, Commissioning, and Training of operators; statutory clearances, if required, may be included. Ensure packing uses standardized weights and original packaging.
The data does not specify a brand; bidders should verify OEM authorizations if required and ensure compliance with any ATC terms and standard HAL procurement practices for defense production.
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Main Document
TECHNICAL
ATC
GEM_GENERAL_TERMS_AND_CONDITIONS