BOND Polymer refine detection,Bond Wash Solution 10 X concentration
Employees State Insurance Corporation
Bid Publish Date
31-Jan-2026, 11:51 am
Bid End Date
21-Feb-2026, 12:00 pm
EMD
₹9,435
Value
₹49,29,766
Location
Progress
Quantity
185
Category
BOND Polymer Refine Detection Part No DS9800
Bid Type
Two Packet Bid
Indian Army invites bids for BOND Polymer Refine Detection Part No DS9800, BOND Wash Solution 10X 1L Part No AR 9590, BOND Slide Label Print Ribbon Part No S21 4564, BOND DAB Mixing Stations Part No S21 1971, BOND Open Containers 7ML Part No OP79193, BOND Titration Kit Part No OPT9049, BOND Universal Cover tiles Pack of 100 Part No S21 2001, BOND Dewax Solution Part No AR9222, BOND Epitope Retrieval 1 1Ltr Part No AR9961, BOND Epitope Retrieval 2 1 Ltr Part No AR9640, Leica Microsystems Plus Slides Part No S21 2113 A, BOND Aspirating Probe Part No S21 0605 in PUNE, MAHARASHTRA. Quantity: 185. Submission Deadline: 21-02-2026 12: 00: 00. Submit your proposal before the deadline.
Main Document
OTHER
BOQ
BOQ
ATC
GEM_GENERAL_TERMS_AND_CONDITIONS
Employees State Insurance Corporation
Tender Results
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| Item # | Title | Description | Quantity | Unit | Consignee | Delivery (Days) |
|---|---|---|---|---|---|---|
| 1 | BOND Polymer Refine Detection Part No DS9800 | BOND Polymer Refine Detection Part No DS9800 | 30 | kit | dglp_microbiology_ghedia | 30 |
| 2 | BOND Wash Solution 10X 1L Part No AR 9590 | BOND Wash Solution 10X 1L Part No AR 9590 | 12 | pack | dglp_microbiology_ghedia | 30 |
| 3 | BOND Slide Label Print Ribbon Part No S21 4564 | BOND Slide Label Print Ribbon Part No S21 4564 | 6 | pack | dglp_microbiology_ghedia | 30 |
| 4 | BOND DAB Mixing Stations Part No S21 1971 | BOND DAB Mixing Stations Part No S21 1971 | 3 | pack | dglp_microbiology_ghedia | 30 |
| 5 | BOND Open Containers 7ML Part No OP79193 | BOND Open Containers 7ML Part No OP79193 | 60 | pack | dglp_microbiology_ghedia | 30 |
| 6 | BOND Titration Kit Part No OPT9049 | BOND Titration Kit Part No OPT9049 | 3 | pack | dglp_microbiology_ghedia | 30 |
| 7 | BOND Universal Cover tiles Pack of 100 Part No S21 2001 | BOND Universal Cover tiles Pack of 100 Part No S21 2001 | 6 | pack | dglp_microbiology_ghedia | 30 |
| 8 | BOND Dewax Solution Part No AR9222 | BOND Dewax Solution Part No AR9222 | 18 | pack | dglp_microbiology_ghedia | 30 |
| 9 | BOND Epitope Retrieval 1 1Ltr Part No AR9961 | BOND Epitope Retrieval 1 1Ltr Part No AR9961 | 5 | pack | dglp_microbiology_ghedia | 30 |
| 10 | BOND Epitope Retrieval 2 1 Ltr Part No AR9640 | BOND Epitope Retrieval 2 1 Ltr Part No AR9640 | 30 | pack | dglp_microbiology_ghedia | 30 |
| 11 | Leica Microsystems Plus Slides Part No S21 2113 A | Leica Microsystems Plus Slides Part No S21 2113 A | 6 | pack | dglp_microbiology_ghedia | 30 |
| 12 | BOND Aspirating Probe Part No S21 0605 | BOND Aspirating Probe Part No S21 0605 | 6 | pack | dglp_microbiology_ghedia | 30 |
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Experience Criteria
Past Performance
Bidder Turnover
Certificate (Requested in ATC)
OEM Authorization Certificate
OEM Annual Turnover
Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria
the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer
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Main Document
OTHER
BOQ
BOQ
ATC
GEM_GENERAL_TERMS_AND_CONDITIONS