Invitation to Bid - Solution for conducting CHIP level analysis of mobile phones in MUMBAI, MAHARASHTRA
Bid Publish Date
19-Feb-2026, 11:17 am
Bid End Date
30-Mar-2026, 5:00 pm
EMD
₹50,000
Location
Progress
Quantity
1
Bid Type
Two Packet Bid
Categories
1
A tender has been published for Directorate Of Forensic Science Laboratories, Maharashtra State, Mumbai Solution for conducting CHIP level analysis of mobile phones (Q3) in MUMBAI, MAHARASHTRA. Quantity: 1 by. Submission Deadline: 30-03-2026 17: 00: 00. Check eligibility and apply.
Additional Tender Data
Commercial Details
Tender Category
Goods
Bid To RA
No
Bid To RA Enabled
No
Item Category
Solution for conducting CHIP level analysis of mobile phones (Q3)
Authority Records
BID & GeM Expert Consultancy
End-to-end support — bid preparation, GeM registration, document filing & compliance by industry experts.
Free consultation · 24h response
Documents 5
GeM-Bidding-9010360.pdf
Main Document
CATALOG-Specification-1
CATALOG Specification
Other Documents
OTHER
Buyer uploaded ATC document
ATC
GEM General Terms and Conditions Document
GEM_GENERAL_TERMS_AND_CONDITIONS
Technical Specifications
1 Item
Item #1 Details
View Catalog| Category | Specification | Requirement |
|---|---|---|
| Specification Sets for :Solution for Conducting CHIP level analysis of Mobile Phones | The JTAG Toolkit include equipment | o RIFF 2 JTAG box o Chisel and Sharp Soldering Tips o Z3X Easy JTAG box o Solder Supplies o JPIN JTAG Connectors o LED Magnification Visor o Digital Multi-meter o Safety Glasses o DC Power Supply o Wire Stripper o Banana Plug Minigrabber o PCB Board o Precision Repair Toolkit o Toolkit Case o Soldering Station o Additional JTAG-specific tools and supplies |
| Specification Sets for :Solution for Conducting CHIP level analysis of Mobile Phones | General Feature of Solution for Conducting CHIP level analysis of Mobile Phones | 1. Support Extraction of chip-off memory, JTAG board, ISP 2. Support Physical/Logical extraction of mobile device 3. Support Extraction of selected partition 4. Support Data preview during extraction 5. Support Write protection and evidence integrity 6. Supports feature phones and smartphones. 7. Supports iOS, Android, Windows, Tizen, Samsung, LG, Pantech, Apple, Microsoft, Nokia, Motorola Global, Chinese, Japanese, Indian mobile phones. 8. Support for various Mobile File Systems viz., FAT12/16/32, exFAT, NTFS, EXT3/4, HFS+, EFS, YAFFS, FSR, XSR 9. General memory chip reader 10. Heat blower for the general disassemble work 11. BGA Reballing kit 12. Hot plate for reballing 13. Microscope - Zoom Stereo, 3.5X~180X 14. Rework station 15. Mobile phone dryer |
| Specification Sets for :Solution for Conducting CHIP level analysis of Mobile Phones | The Chip off Toolkit should at least include the equipment: | o Z3X Easy JTAG box o Pin Probe Test Socket Adapters o Digital Multi-meter o Milling Machine o Precision Repair Toolkit o Chip-off Heat Station o Soldering Station o Reflow Oven o Solder Supplies o Hotair Rework Station o LED Magnification Visor o eMMC and UFS Programming Tools o Safety Glasses o Toolkit case o PCB Holder o Additional chip-ff specific tools and supplies o Microscope for Electronics |
| Specification Sets for :Solution for Conducting CHIP level analysis of Mobile Phones | The Software and the Hardware related apps preloaded on to a system which is part of the suite consists of the specs | o OS: Windows 10 o CPU: i7 o RAM: 64GB or more o HDD: 2TB or more o Display: 1024x768 or above o USB: USB 2.0 port 4 or higher |
| Specification Sets for :Solution for Conducting CHIP level analysis of Mobile Phones | SW Licenses | Perpetual Licensing through USB Dongle |
| Specification Sets for :Solution for Conducting CHIP level analysis of Mobile Phones | Initial Support / Warranty of Licenses after commissioning | 1, 2, 3, 4, 5 |
| Specification Sets for :Solution for Conducting CHIP level analysis of Mobile Phones | Service Maintenance Support (SMS) / ATS with update/upgrade for a period of (in years ) after expiry of initial service maintenance support /warranty | 1, 2, 3, 4, 5 |
| Specification Sets for :Solution for Conducting CHIP level analysis of Mobile Phones | Desirable Attribute of Supply | o Solution should include certified training for 03 Experts from OEM with in India or at OEM location |
🤖 AI-Powered Bidder Prediction
Discover companies most likely to bid on this tender
Required Documents
Experience Criteria
Past Performance
Bidder Turnover
Certificate (Requested in ATC)
OEM Authorization Certificate
OEM Annual Turnover
Additional Doc 1 (Requested in ATC)
Additional Doc 2 (Requested in ATC) *In case any bidder is seeking exemption from Experience / Turnover Criteria
the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer
Corrigendum Updates
5 Updates Update
Extended Deadline
30-Mar-2026, 5:00 pm
Opening Date
30-Mar-2026, 5:30 pm
Update
Extended Deadline
26-Mar-2026, 5:00 pm
Opening Date
26-Mar-2026, 5:30 pm
Update
Extended Deadline
23-Mar-2026, 5:00 pm
Opening Date
23-Mar-2026, 5:30 pm
Update
Extended Deadline
19-Mar-2026, 5:00 pm
Opening Date
19-Mar-2026, 5:30 pm
Update
Extended Deadline
12-Mar-2026, 5:00 pm
Opening Date
12-Mar-2026, 5:30 pm
Explore More Opportunities
Unlock Tender Documents
Sign up now to access all documents
Documents 5
GeM-Bidding-9010360.pdf
Main Document
CATALOG-Specification-1
CATALOG Specification
Other Documents
OTHER
Buyer uploaded ATC document
ATC
GEM General Terms and Conditions Document
GEM_GENERAL_TERMS_AND_CONDITIONS