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GEM

Invitation to Bid - Semiconductor Fabrication Technologies,Processes,Process Materials,Device simulation capability,Phy in GANJAM, ODISHA

Bid Publish Date

17-Jun-2025, 5:10 pm

Bid End Date

07-Jul-2025, 6:00 pm

Location

GANJAM , ODISHA

Progress

Issue17-Jun-2025, 5:10 pm
AwardPending
Explore all 5 tabs to view complete tender details

Quantity

14

Category

Semiconductor Fabrication Technologies

Bid Type

Two Packet Bid

Categories 62

BP INSTRUMENT VOLTMETER SPECTROSCOPIC EQUIPMENT ELECTRICAL SOLAR CELLS PLATFORM SCALE DECIBEL METER SILICON CARBIDE DIODE GLUCOMETER ELECTRON TUBE ELECTRONIC PRODUCTS AND APPLIANCES ANVIL PARAMETER TEST PRESSURE GAUGE TESTING INSTRUMENT ION IMPLANTATION SIMULATOR WEIGH BRIDGE THERMOWELLS SANITARY WARE ELECTROSTATIC PRECIPITATOR SENSOR WATER LEVEL RECORDER SANITARY FITTING PRESS OFFSET PRINTING BODYWEIGHT MEASURING SCALE RADIO FREQUENCY ANALYSER ELECTRONIC COMPONENTS AND SUPPLIES FAULT ANALYSIS BIPOLAR JUNCTION TRANSISTORS ROUTINE MAINTENANCE SMART POSITIONER WATTMETERS ARCHITECTURAL DRAWING CHEMICAL ENGINEERING INTEGRATED CIRCUITS AMC OF ELECTRONIC TRANSPORT PYROMETERS ARTICULATING LAZY ARMS GI WIRE THICKNESS GAUGE COMPRESSED SHEET RECTIFIERS MAINTENANCE CONTRACT OF ELECTRONIC DETECTOR ENGINE POWER ALUMINIUM ALLOY PEB METALLOGRAPHY SOFTWARE METALLURGY MEDICAL DIAGNOSTIC GAMMA CAMERAS PNEUMATIC POSITIONER POLYMERASE CHAIN REACTION PCR PAPER AND PRINTING SERVICES WEIGHTS AUDIOMETERS AUTO CAD OPERATOR

N/a invites bids for Semiconductor Fabrication Technologies, Processes, Process Materials, Device simulation capability, Physics based Models, Material Library, Thermal Effect Simulation, Optoelectronics Device Simulation, Circuit simulation, Noise simulation, Quantum Mechanical effect simulation, User defined Models and Library elements, Run time interactive tool, Graphical display and analysis tool in GANJAM, ODISHA. Quantity: 14. Submission Deadline: 07-07-2025 18: 00: 00. Submit your proposal before the deadline.

Documents 5

GeM-Bidding-7949709.pdf

Main Document

BOQ Document

BOQ

BOQ Document

BOQ

Buyer uploaded ATC document

ATC

GEM General Terms and Conditions Document

GEM_GENERAL_TERMS_AND_CONDITIONS

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Bill of Quantities (BOQ) 14 Items

Item # Title Description Quantity Unit Consignee Delivery (Days)
1 Semiconductor Fabrication Technologies This software shall be capable of fast and accurate simulation of all critical fabrication processes used in modern semiconductor technologies including RF Devices HEMT FET HBT FET BJT JFET, IGBT SOI TFT FinFET etc Multiple Gate FETs MuGFETS FinFET FlexFET Gate All Around GAA FETs etc IR detector and Sensor devices Solar cells Primarily focused on compound semiconductors 1 nos superintendent_hostel 30
2 Processes It should possess advanced physical models for following processes Doping diffusion including rapid thermal annealing RTA Ion implantation Oxidation with stress effects Physical etching and deposition eg CVD PVD plasma etching RIE etc Epitaxy and stress formation and strain stress engineering Optical lithography These process models shall be capable of Interactive visualization of 2D structures and distributions as well as 1D cross sections Run time extraction of process parameters Optimization of process flow and calibration of process models Easy creation and modification of process flow input decks including automatic control of layout GDS2 mask sequences 1 nos superintendent_hostel 30
3 Process Materials It should be capable of providing process simulation for variety of materials used in the semiconductor industry like Silicon IIIV IIIN IIVI IVIV but not limited to Silicon Carbides SiC Compound Semiconductors eg GaN AlGaN GaAs AlGaAs InGaAs InP etc Silicon Silicon Germanium SiGe All Schottky and Ohmic contact metals and dielectric insulating materials used in Semiconductor Nano electronics device technology 1 nos superintendent_hostel 30
2 Device simulation capability The device simulation software should be capable of Analyzing and characterizing the electrical optical and thermal performance of various devices in 2D and 3D Fully integrated with process simulation software comprehensive visualization package and extensive database of examples Material parameters and physical models for a wide range of Silicon III V III N II VI IV IV like compound semiconductor materials and polymer organic based technologies Compatible with smartSPICE and device other simulators SPICE 1 nos superintendent_hostel 30
5 Physics based Models It should cater Physics based models like drift diffusion energy balance transport equations surface bulk mobility recombination impact ionization and tunneling models The capabilities of all the physical models should be extended to deep submicron devices The models should be capable to calculate all measurable electrical parameters which include gate and drain characteristics sub threshold leakage substrate currents and punch through voltage breakdown behavior kink and snapback effects low temperature and high temperature operation RF AC parameters and intrinsic switching times Boltzmann and Fermi-Dirac statistics with band gap narrowing 1 nos superintendent_hostel 30
6 Material Library It shall cover materials as per para 1 3 Library of binary ternary and quaternary semiconductors as well as other important advanced materials along with material parameters Built in materials library that contains parameters for all well-known semiconductor materials 1 nos superintendent_hostel 30
7 Thermal Effect Simulation It should be able to model heat generation heat flow lattice heating heat sinks and effects of local temperature on physical constant It should provide an ideal environment for design and optimization of power devices Applications include characterization of device design thermal failure analysis and heat sink designs This module should be capable for both 2D and 3D device simulation 1 nos superintendent_hostel 30
8 Optoelectronics Device Simulation It should be able to model light absorption and photo generation in non planar semiconductor devices It should account for arbitrary topologies internal and external reflections and refractions polarization dependencies and dispersion Optical transfer matrix method and EM wave method for coherence effects in layered devices It should be applicable to a wide array of device technologies including CCDs solar cells photodiodes photoconductors avalanche photodiodes Metal-Semiconductor Metal photodetectors phototransistors microlens coupled detector This module should be capable for both 2D and 3D device simulation 1 nos superintendent_hostel 30
9 Circuit simulation It should contain physically based devices in addition to compact analytical models It should be compatible to small and large signal analysis of RF devices It should contain Compact analytical models for high power circuits including variety of devices such as diode HEMT bipolar thyristor GTO MOS and IGBT devices This module should be capable for both 2D and 3D device simulation 1 nos superintendent_hostel 30
10 Noise simulation It should be capable of analyzing small signal noise generated within semiconductor devices It should be capable of characterizing small signal noise sources and extract figure of merit for circuit designThis module shall preferably be capable for noise device simulations 1 nos superintendent_hostel 30
11 Quantum Mechanical effect simulation It should provide a set of models for simulation of various effects of quantum confinement and quantum transport of carriers in semiconductor devices It should allow quantum mechanical calculation of bound state energies and associated carrier wave functions self consistently with electrostatic potential Should associate with Schrodinger solvers with Non Equilibrium Green Function NEGF Approach in order to model ballistic quantum transport in 2D or cylindrical devices with strong transverse confinement This module should be capable for both 2D and 3D device simulation 1 nos superintendent_hostel 30
12 User defined Models and Library elements It should have capability of user defined physical models and material parameters via standard language interface eg C C plus etc It should have capability of user defined functions such as doping composition fraction defect density of state temperature and composition dependent band parameters mobility recombination and generation models at run time 1 nos superintendent_hostel 30
13 Run time interactive tool It should have numerous simulator specific and general debugger style tools such as powerful extract statements GUI based process input line by line runtime execution and intuitive input syntactical error messages Should support str file format for model generation 1 nos superintendent_hostel 30
14 Graphical display and analysis tool This tool should have following capabilities A powerful tool is required to visualize 1D and 2D or 3D structures produced by TCAD simulators It should provide visualization and graphic features such as pan zoom views labels and multiple plot support Plotting engine should support all common 1D and 2D 3D data views including 2D 3D contour data 2D 3D meshed data smith charts and polar charts Exports data in many common formats jpg png bmp SPICE raw file and CSV for use in reports or by third party tools The simulation result xy type data generated by the software should be in the format compatible for direct export to spreadsheet like MS excel 1 nos superintendent_hostel 30

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Required Documents

1

Experience Criteria

2

Past Performance

3

Bidder Turnover

4

Certificate (Requested in ATC)

5

OEM Authorization Certificate

6

OEM Annual Turnover

7

Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria

8

the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer

Frequently Asked Questions

Key insights about ODISHA tender market

What are the eligibility requirements for the SILVACO TCAD OMNI University Bundle?

The eligibility requirements include being a registered entity, capable of providing the necessary semiconductor fabrication technologies and educational materials as specified. Bidders are required to comply with local laws, demonstrating competence through past performance in similar projects.

What certifications are required for participation?

Participants must possess relevant certifications that affirm their capability in delivering semiconductor technologies and educational materials. Compliance with industry quality standards and documentation substantiating past projects can enhance the eligibility for consideration.

What is the registration process for the SILVACO TCAD OMNI University Bundle?

The registration process involves submitting an application through the official procurement portal and providing necessary documentation as outlined in the tender. Vendors must ensure all paperwork is complete, accurately reflecting their capabilities and compliance with technical specifications.

What are the accepted document formats for submission?

All submissions should be made in electronic formats accepted by the procurement portal. Typically, this includes PDF and Microsoft Office formats for ease of review and evaluation. Bidders are encouraged to check the portal for any specifications regarding file types and sizes.

What are the performance security requirements for this tender?

Performance security requirements mandate that successful bidders provide a guarantee in the form of a bank guarantee or equivalent financial assurance. This ensures fulfillment of the tender conditions and adherence to delivery timelines, thus safeguarding the interests of the Skill Development and Technical Education Department.