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Government Tender Published for Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging in CENTRAL, DELHI

Bid Publish Date

01-Oct-2026, 11:40 am

Bid End Date

15-Oct-2026, 8:30 am

EMD

₹2,97,175

Progress

Issue01-Oct-2026, 11:40 am
AwardPending

Department of Defence Research and Development invites bids for Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging in CENTRAL, DELHI. Submission Deadline: 15-10-2026 08: 30: 00. Submit your proposal before the deadline.

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Tender Data

Bid Details

Tender Type

Single

Contract Type

Tender

Tender Fee

₹0

EMD Exemption

Yes

Category

Miscellaneous Services

Contract Form

Supply

Contract Period

240

Bid Submission Start

02-10-2026 15:00:00

Document Download Start

01-10-2026 17:30:00

Document Download End

15-10-2026 14:00:00

Bid Validity

180

Withdrawal Allowed

Yes

Payment Mode

Offline

Technical Eval

No

Item Technical Evaluation

No

Multi Currency BOQ

Yes

Allow NDA Tender

No

Allow Preferential Bidder

No

Requirements

NDA Pre-Qualification

Please refer Tender documents.

Additional Tender Data

Commercial Details

Tender Category

Service

Payment Mode

Offline

EMD Payable To

DIRECTOR, SSPL

Bid To RA

No

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Documents 1

Download as zip file

ZIP_PACKAGE

Authority & Contact

Organization

Department of Defence Research and Development

Organization Chain

Department of Defence Research and Development||Defence Research and Development Organisation||DFMM||Office of DG (MED and COS)||SSPL

Bid Opening Place

ONLINE

Work Location

View More Details Tender Details   Basic Details Organisation Chain Department of Defence Research and Development||Defence Research and Development Organisation||DFMM||Office of DG (MED and COS)||SSPL Tender Reference Number SSPL/MMG/DPP/SBM/B/R/26-27/094 Tender ID 2026_DRDO_792120_1 Withdrawal Allowed Yes Tender Type Single Form Of Contract Supply Tender Category Services No. of Covers 2 General Technical Evaluation Allowed No ItemWise Technical Evaluation Allowed No Payment Mode Offline Is Multi Currency Allowed For BOQ Yes Is Multi Currency Allowed For Fee No Allow Two Stage Bidding No   Payment Instruments Offline S.No Instrument Type 1 Bankers Cheque 2 Bank Guarantee 3 Demand Draft 4 FDR Covers Information, No. Of Covers - 2 Cover No Cover Type Description Document Type 1 Fee/PreQual/Technical PLEASE SUBMIT THE DOCUMENTS AS PER S.NO. 16 PART I(A) OF RFP DOCUMENTS. .pdf 2 Finance SUBMIT THE PRICE AS PER ATTACHED BOQ FORMAT. .xls       Tender Fee Details, [Total Fee in ₹ * - 0.00] Tender Fee in ₹ 0.00 Fee Payable To Nil Fee Payable At Nil Tender Fee Exemption Allowed No EMD Fee Details EMD Amount in ₹ 2,97,175 EMD Exemption Allowed Yes EMD Fee Type fixed EMD Percentage NA EMD Payable To DIRECTOR, SSPL EMD Payable At DELHI   Foreign Currency BOQ Details S.No Currency Conversion rate in ₹ 1 US Dollar NA 2 European Euro NA 3 British Pound NA 4 Japanese yen NA   Work Item Details Title Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging Work Description Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging NDA/Pre Qualification Please refer Tender documents. Independent External Monitor/Remarks NA Tender Value in ₹ NA Product Category Miscellaneous Services Sub category NA  Contract Type Tender Bid Validity(Days) 180 Period Of Work(Days) 240  Location SSPL, DELHI Pincode 110054 Pre Bid Meeting Place NA  Pre Bid Meeting Address NA  Pre Bid Meeting Date NA  Bid Opening Place ONLINE Should Allow NDA Tender No  Allow Preferential Bidder No Tenderer Class As per Tender Document   Critical Dates Published Date 01-Oct-2026 05:10 PM Bid Opening Date 16-Oct-2026 02:30 PM Document Download / Sale Start Date 01-Oct-2026 05:30 PM Document Download / Sale End Date 15-Oct-2026 02:00 PM Clarification Start Date NA Clarification End Date NA Bid Submission Start Date 02-Oct-2026 03:00 PM Bid Submission End Date 15-Oct-2026 02:00 PM   Tenders Documents NIT Document S.No Document Name Description Document Size (in KB) 1 Tendernotice_1.pdf   ATTACHED 2451.90 Download as zip file Work Item Documents S.No Document Type Document Name Description Document Size (in KB) 1 Tender Documents RFP2627094.pdf ATTACHED 3383.11 2 BOQ BOQ_888144.xls ATTACHED 320.50   Tender Inviting Authority Name KUNAL BHUSHAN, SR. STORES OFFICER-II Address DRDO, SSPL, LUCKNOW ROAD, TIMARPUR, DELHI, INDIA   Back

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