Progress
Department of Defence Research and Development invites bids for Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging in CENTRAL, DELHI. Submission Deadline: 15-10-2026 08: 30: 00. Submit your proposal before the deadline.
Tender Type
Single
Contract Type
Tender
Tender Fee
₹0
EMD Exemption
Yes
Category
Miscellaneous Services
Contract Form
Supply
Contract Period
240
Bid Submission Start
02-10-2026 15:00:00
Document Download Start
01-10-2026 17:30:00
Document Download End
15-10-2026 14:00:00
Bid Validity
180
Withdrawal Allowed
Yes
Payment Mode
Offline
Technical Eval
No
Item Technical Evaluation
No
Multi Currency BOQ
Yes
Allow NDA Tender
No
Allow Preferential Bidder
No
NDA Pre-Qualification
Please refer Tender documents.
Tender Category
Service
Payment Mode
Offline
EMD Payable To
DIRECTOR, SSPL
Bid To RA
No
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ZIP_PACKAGE
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