Hindustan Aeronautics Limited (hal) announces a tender for GC201300-013, BLANK PCB GLASS EPOXY FR4, GC203001- 053-VER: 01, GLASS EPOXY MULTILAYER FR4 PCB SIZE: 180 X 116 X 1. 6 MM, 06 LAYERS, MIL-PRF-5511, GC204001-053- VER: 01, GLASS EPOXY MULTI-LAYER(08 LAYERS) FR4 PCB, GC205001-053-VER: 01, GLASS EPOXY MULTI-LAYER FR4 PCB Blank (04Layer), GC206001-053-VER: 01, GLASS EPOXY MULTI-LAYER FR4 PCB BLANK(6-Layer), GC207001- 053-VER: 01, Glass Epoxy Multi-layer FR4 PCB Blank (8 Layer), , GC208001-053-VER: 01, MULTI LAYER RIGID GLASS EPOXY FR4 PCB, , FC000300-02, Glass epoxy multilayer Glass epoxy multilayer FR4 PCB, FC000400-02, Bare PCB, M4020707203, CONNECTOR MODULE BARE PCB 18 LAYER, , M4020709303, MOTHER BOARD PCB Rev- 00, 22 Layer FR4 PCB, in SULTANPUR, UTTAR PRADESH. Quantity: 477. Submission Deadline: 07-11-2025 11: 00: 00. Last date to apply is approaching fast!
Invitation to Bid – GC201300-013, BLANK PCB GLASS EPOXY FR4,GC203001-053-VER: 01, GLASS EPOXY MULTILAYER FR4 PCB SIZE: in SULTANPUR, UTTAR PRADESH
Progress
Quantity
477
Category
GC201300-013, BLANK PCB GLASS EPOXY FR4
Bid Type
Single Packet Bid
Categories
2
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Documents 22
GeM-Bidding-8510250.pdf
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GEM General Terms and Conditions Document
GEM_GENERAL_TERMS_AND_CONDITIONS
GeM-Bidding-8510250.pdf
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Buyer uploaded ATC document
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GEM General Terms and Conditions Document
GEM_GENERAL_TERMS_AND_CONDITIONS