High Speed Precision Cutting Machine with Wafering Blades
Office Of Dg ( Ns & M)
HYDERABAD, TELANGANA
Bid Publish Date
13-May-2026, 3:15 pm
Bid End Date
04-Jun-2026, 3:00 pm
Progress
Quantity
20
Category
Precision Cutting Diamond wafering blades High Concentration for ductile material
Bid Type
Two Packet Bid
A tender has been published for Directorate Of Purchase And Stores Precision Cutting Diamond wafering blades High Concentration for ductile material, Precision Cutting Diamond wafering blades Low concentration for hard materials. Quantity: 20 by. Submission Deadline: 04-06-2026 15: 00: 00. Check eligibility and apply.
Tender Category
Goods
Bid To RA
No
Bid To RA Enabled
No
Item Category
Precision Cutting Diamond wafering blades High Concentration for ductile material , Precision Cutting Diamond wafering blades Low concentration for hard materials
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Main Document
OTHER
OTHER
ATC
GEM_GENERAL_TERMS_AND_CONDITIONS
Office Of Dg ( Ns & M)
HYDERABAD, TELANGANA
Directorate Of Purchase And Stores
INDORE, MADHYA PRADESH
Office Of Dg ( Ns & M)
Indian Space Research Organization
AHMEDABAD, GUJARAT
Directorate Of Purchase And Stores
MUMBAI, MAHARASHTRA
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Certificate (Requested in ATC)
OEM Authorization Certificate *In case any bidder is seeking exemption from Experience / Turnover Criteria
the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer
Office Of Dg ( Ns & M)
📍 HYDERABAD, TELANGANA
Geological Survey Of India (gsi)
India Optel Limited
📍 DEHRADUN, UTTARAKHAND
Bharat Heavy Electricals Limited (bhel)
📍 BHOPAL, MADHYA PRADESH
Advanced Weapons And Equipment India Limited
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Main Document
OTHER
OTHER
ATC
GEM_GENERAL_TERMS_AND_CONDITIONS