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Contract Bidding Open For Precision Cutting Diamond wafering blades High Concentration for ductile material,Precision Cutting

Bid Publish Date

13-May-2026, 3:15 pm

Bid End Date

04-Jun-2026, 3:00 pm

Progress

Issue13-May-2026, 3:15 pm
AwardPending
Explore all 4 tabs to view complete tender details

Quantity

20

Category

Precision Cutting Diamond wafering blades High Concentration for ductile material

Bid Type

Two Packet Bid

Categories 4

A tender has been published for Directorate Of Purchase And Stores Precision Cutting Diamond wafering blades High Concentration for ductile material, Precision Cutting Diamond wafering blades Low concentration for hard materials. Quantity: 20 by. Submission Deadline: 04-06-2026 15: 00: 00. Check eligibility and apply.

Additional Tender Data

Commercial Details

Tender Category

Goods

Bid To RA

No

Bid To RA Enabled

No

Item Category

Precision Cutting Diamond wafering blades High Concentration for ductile material , Precision Cutting Diamond wafering blades Low concentration for hard materials

Authority Records

DEPARTMENT OF ATOMIC ENERGYDIRECTORATE OF PURCHASE AND STORES
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Documents 5

GeM-Bidding-9282964.pdf

Main Document

Other Documents

OTHER

Other Documents

OTHER

Buyer uploaded ATC document

ATC

GEM General Terms and Conditions Document

GEM_GENERAL_TERMS_AND_CONDITIONS

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Required Documents

1

Certificate (Requested in ATC)

2

OEM Authorization Certificate *In case any bidder is seeking exemption from Experience / Turnover Criteria

3

the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer

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