Bid Publish Date
05-Oct-2026, 12:57 pm
Bid End Date
19-Oct-2026, 2:00 pm
Value
₹6,41,920
Location
Progress
Centre For Development Of Advanced Computing (c-dac) invites bids for NUC Mini PC, Internal SSD, External SSD, MicroSD Card, Type-C Multiple ports, Printer Filament ABS, 3D Camera, Web, Cam, Thermal Camera Core, Thermal Breakout Board FLIR, USB, Raspberry Pi 5 8GB, ESP32, Screen, PCB in CHENNAI, TAMIL NADU. Quantity: 45. Submission Deadline: 19-10-2026 14: 00: 00. Submit your proposal before the deadline.
Quantity
45
Category
NUC Mini PC
Bid Type
Two Packet Bid
Bid Validity
180 (Days)
Bid Type
Service
Evaluation
Total value wise evaluation
Inspection Required
No
Tech Clarification Time
2 Days
EMD Required
No
MII Purchase Preference
Yes
MII Preference Band
L1+20%
MSE Purchase Preference
Yes
MSE Preference Band
L1+15%
MSE Exemption/Relaxation
No
Startup Exemption/Relaxation
No
Bid Splitting Applied
No
Arbitration Clause
No
Mediation Clause
No
Tender Category
Goods
Bid To RA
No
Bid To RA Enabled
No
Item Category
NUC Mini PC , Internal SSD , External SSD , MicroSD Card , Type-C Multiple ports , Printer Filament ABS , 3D Camera , Web , Cam , Thermal Camera Core , Thermal Breakout Board FLIR , USB , Raspberry Pi 5 8GB , ESP32 , Screen , PCB
Advisory Bank
State Bank of India
ePBG Percentage
5%
ePBG Duration (Months)
6
Max Delivery Days
15
Delivery Locations
1
Delivery Cities
Chennai
Delivery Pincodes
600113
| Consignee | Address | City | State | Pincode | Quantity | Delivery Days | Additional Requirement |
|---|---|---|---|---|---|---|---|
| Nagarajan R | 600113,C-DAC Tidel Park 8th Floor D block Taramani | Chennai | Tamil Nadu | 600113 | 2 | 15 | - |
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Main Document
BOQ
BOQ
OTHER
GEM_GENERAL_TERMS_AND_CONDITIONS
Extended Deadline
19-Oct-2026, 8:30 am
Opening Date
20-Oct-2026, 8:30 am
NUC Mini PC
Intel i7/ultra 7, ram 16GB, 500GB SDD
Internal SSD
1 TB, M.2 SSD
External SSD
2TB SSD, Type C
MicroSD Card
64GB, UHS-I, U3, V30
Type-C Multiple ports
USB-C Hub, , HDMI + Ethernet+ SDcard reader + VGA + 2xUSB 3.0A + USB-C + PD
Printer Filament ABS
ABS 2.85mm
3D Camera
Intel REALSENSE DEPTH CAMERA D456
Web
1800p
Cam
PURETHERMAL-3
Thermal Camera Core
Lepton 3.5 sensor (500-0771-01)
Thermal Breakout Board FLIR
FLIR Breakout Board (250-0577-00)
USB
USB GPS Receiver ( TEL0137)
Raspberry Pi 5 8GB
Custom trainng Kit
ESP32
XIAO-ESP32S3
Screen
SC1169
PCB
cm
| Item # | Title | Description | Quantity | Unit | Consignee | Delivery (Days) | Price Trends |
|---|---|---|---|---|---|---|---|
| 1 | NUC Mini PC | Intel i7/ultra 7, ram 16GB, 500GB SDD | 2 | pieces | cdacconsignee1 | 15 | |
| 2 | Internal SSD | 1 TB, M.2 SSD | 1 | pieces | cdacconsignee1 | 15 | |
| 3 | External SSD | 2TB SSD, Type C | 3 | pieces | cdacconsignee1 | 15 | |
| 4 | MicroSD Card | 64GB, UHS-I, U3, V30 | 10 | pieces | cdacconsignee1 | 15 | |
| 5 | Type-C Multiple ports | USB-C Hub, , HDMI + Ethernet+ SDcard reader + VGA + 2xUSB 3.0A + USB-C + PD | 4 | pieces | cdacconsignee1 | 15 | |
| 6 | Printer Filament ABS | ABS 2.85mm | 4 | pieces | cdacconsignee1 | 15 | |
| 7 | 3D Camera | Intel REALSENSE DEPTH CAMERA D456 | 1 | pieces | cdacconsignee1 | 15 | |
| 8 | Web | 1800p | 1 | pieces | cdacconsignee1 | 15 | |
| 9 | Cam | PURETHERMAL-3 | 1 | pieces | cdacconsignee1 | 15 | |
| 10 | Thermal Camera Core | Lepton 3.5 sensor (500-0771-01) | 1 | pieces | cdacconsignee1 | 15 | |
| 11 | Thermal Breakout Board FLIR | FLIR Breakout Board (250-0577-00) | 1 | pieces | cdacconsignee1 | 15 | |
| 12 | USB | USB GPS Receiver ( TEL0137) | 1 | pieces | cdacconsignee1 | 15 | |
| 13 | Raspberry Pi 5 8GB | Custom trainng Kit | 1 | pieces | cdacconsignee1 | 15 | |
| 14 | ESP32 | XIAO-ESP32S3 | 2 | pieces | cdacconsignee1 | 15 | |
| 15 | Screen | SC1169 | 2 | pieces | cdacconsignee1 | 15 | |
| 16 | PCB | cm | 10 | pieces | cdacconsignee1 | 15 |
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OEM Authorization Certificate
Additional Doc 1 (Requested in ATC)
Additional Doc 2 (Requested in ATC) *In case any bidder is seeking exemption from Experience / Turnover Criteria
the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer