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Polishing Compound state-wide in Gujarat

Polishing Compound Tenders in Gujarat

Access live Polishing Compound procurement tenders in Gujarat state

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Heavy Duty Pipe wrench 6 inch,Heavy Duty Pipe wrench 12inch,Heavy Duty Pipe wrench 18inch,Heavy Dut

Oil And Natural Gas Corporation Limited

ANAND, GUJARATPosted 9 Jul
₹1.5 L
GEMGoods3 Documents
Category: Heavy Duty Pipe wrench 6 inch , Heavy Duty Pipe wrench 12inch , Heavy Duty Pipe wrench 18inch , Heavy Duty Pipe wrench 24inch , BALL PEEN HAMMER 500 GM Rubber handle , Sledge Hammer 1kg with wooden handle , Divider rivet joint 12inch , Tool box cantilever 5 compartment , Double ended Open Spanner set mm Pouch , Ring spanner set mm Pouch , Rachet Combination Spanner set 14mm 15mm 16mm 17mm 18mm 19mm 22mm 24mm , Allen key long mm , Allen Key Long Inch , Drill sleeve MT 4 5 T S , Drill sleeve MT 3 5 T S , Carbide drill bits 2 16 mm , HSS Taper shank drill bits 65mm , MAGNETIC RETRIEVING TOOL , Heavy industrial cutter blade , Octagonal chisel 9inch , Octagonal chisel 6inch , Thread sealant 50ml , Bearing retainer 50ml , All purpose spray 200 ml , Zinc spray 500ml , Silicone Lubricant Grease for O ring 500gm , Valve Lapping compound 400gm , Lever Greasing gun Long handle with nozzle set , Small ratchet set Power Hand Tool Kit , Pry bar , Sledge Hammer 500 gm Rubber handle , Barrel pump
Deadline
31 Jul 2025
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1. Cast iron plain Hand lapping plate -dia- 6 inch- 30 mm thick,2. Cast iron plain Hand lapping pla

Nuclear Power Corporation Of India Limited

SURAT, GUJARATPosted 7 Oct
EMD: ₹14,918
GEMGoods4 Documents
Category: 1. Cast iron plain Hand lapping plate -dia- 6 inch- 30 mm thick , 2. Cast iron plain Hand lapping plate -dia- 12 inch- 30 mm thick , 3. Cast iron plain Hand lapping plate -dia- 18 inch- 30 mm thick , 4. Copper hand polishing plate mounted on MS base plate -dia- 6 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 5. Copper hand polishing plate mounted on MS base plate -dia- 12 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 6. Copper hand polishing plate mounted on MS base plate -dia- 18 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 7. Diamond lapping compound having grades of grain size 10 microns and packing in 5 gms of syringe , 8. Diamond lapping compound having grades of grain size 15 microns and packing in 5 gms of syringe , 9. Diamond lapping compound having grades of grain size 25 microns and packing in 5 gms of syringe , 10. Diamond lapping compound having grades of grain size 45 microns and packing in 5 gms of syringe , 11. Diamond lapping compound having grades of grain size 70 microns and packing in 5 gms of syringe , 12. Diamond lapping compound having grades of grain size 90 microns and packing in 5 gms of syringe , 13. Lapping abrasive liquid having grain size of 03 microns suitable for use in electrically operated lapping machine
Deadline
4 Nov 2025
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1. Cast iron plain Hand lapping plate -dia- 6 inch- 30 mm thick,2. Cast iron plain Hand lapping pla

Nuclear Power Corporation Of India Limited

SURAT, GUJARATPosted 30 Jan
EMD: ₹14,918
GEMGoods4 Documents
Category: 1. Cast iron plain Hand lapping plate -dia- 6 inch- 30 mm thick , 2. Cast iron plain Hand lapping plate -dia- 12 inch- 30 mm thick , 3. Cast iron plain Hand lapping plate -dia- 18 inch- 30 mm thick , 4. Copper hand polishing plate mounted on MS base plate -dia- 6 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 5. Copper hand polishing plate mounted on MS base plate -dia- 12 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 6. Copper hand polishing plate mounted on MS base plate -dia- 18 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 7. Diamond lapping compound having grades of grain size 10 microns and packing in 5 gms of syringe , 8. Diamond lapping compound having grades of grain size 15 microns and packing in 5 gms of syringe , 9. Diamond lapping compound having grades of grain size 25 microns and packing in 5 gms of syringe , 10. Diamond lapping compound having grades of grain size 45 microns and packing in 5 gms of syringe , 11. Diamond lapping compound having grades of grain size 70 microns and packing in 5 gms of syringe , 12. Diamond lapping compound having grades of grain size 90 microns and packing in 5 gms of syringe , 13. Lapping abrasive liquid having grain size of 03 microns suitable for use in electrically operated lapping machine
Deadline
27 Feb 2026
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