Bullet Resi Plate 6 Point 5mm,Bullet Resi Plate 2 Point 5mm,Armd Rod,Cutting Wheel 14 inch Large,Cu
Indian Army
BARAMULLA, JAMMU & KASHMIR
Bid Publish Date
28-Sep-2024, 10:52 am
Bid End Date
13-Nov-2024, 11:00 am
EMD
₹23,676
Progress
Quantity
1108
Category
Supply of cast iron plain hand lapping plate Diameter 12 inch
Bid Type
Two Packet Bid
Nuclear Power Corporation Of India Limited announces a tender for Supply of cast iron plain hand lapping plate Diameter 6 inch, Supply of cast iron plain hand lapping plate Diameter 12 inch, Supply of cast iron plain hand lapping plate Diameter 18 inch 30 mm, Supply of Copper hand polishing Plate mounted on MS Base Plate Diameter 6 inch, Supply of Copper hand polishing Plate mounted on MS Base Plate Diameter 12 inch, Supply of Copper hand polishing Plate mounted on MS Base Plate Diameter 18 inch, Supply of Diamond Lapping Compounds having grades of grain size 10 microns, Diamond Lapping Compounds having grades of grain size 15 microns, Diamond Lapping Compounds having grades of grain size 45 microns, Diamond Lapping Compounds having grades of grain size25 microns, Diamond Lapping Compounds having grades of grain size 70 microns, Diamond Lapping Compounds having grades of grain size 90 microns, Lapping abrasive liquid having grades of grain size 03 micron. Quantity: 1108. Submission Deadline: 13-11-2024 11: 00: 00. Last date to apply is approaching fast!
Main Document
OTHER
BOQ
BOQ
OTHER
GEM_GENERAL_TERMS_AND_CONDITIONS
Indian Army
BARAMULLA, JAMMU & KASHMIR
Indian Army
JALANDHAR, PUNJAB
Indian Army
Indian Army
Indian Army
KUPWARA, JAMMU & KASHMIR
Tender Results
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| Item # | Title | Description | Quantity | Unit | Consignee | Delivery (Days) |
|---|---|---|---|---|---|---|
| 1 | Supply of cast iron plain hand lapping plate Diameter 6 inch | Supply of cast iron plain hand lapping plate Diameter 6 inch 30 mm thick | 4 | no | con2.gj | 120 |
| 2 | Supply of cast iron plain hand lapping plate Diameter 12 inch | Supply of cast iron plain hand lapping plate Diameter 12 inch 30 mm thick | 3 | no | con2.gj | 120 |
| 3 | Supply of cast iron plain hand lapping plate Diameter 18 inch 30 mm | Supply of cast iron plain hand lapping plate Diameter 18 inch 30 mm thick | 2 | no | con2.gj | 120 |
| 4 | Supply of Copper hand polishing Plate mounted on MS Base Plate Diameter 6 inch | Supply of Copper hand polishing Plate mounted on MS Base Plate Diameter 6 inch x Thick 30 mm | 4 | no | con2.gj | 120 |
| 5 | Supply of Copper hand polishing Plate mounted on MS Base Plate Diameter 12 inch | Supply of Copper hand polishing Plate mounted on MS Base Plate Diameter 12 inch x Thick 30 mm | 3 | no | con2.gj | 120 |
| 6 | Supply of Copper hand polishing Plate mounted on MS Base Plate Diameter 18 inch | Supply of Copper hand polishing Plate mounted on MS Base Plate Diameter 18 inch x Thick 30 mm | 2 | no | con2.gj | 120 |
| 7 | Supply of Diamond Lapping Compounds having grades of grain size 10 microns | Supply of Diamond Lapping Compounds having grades of grain size - 10 microns and packing of each 05 grams syringe | 180 | no | con2.gj | 120 |
| 8 | Diamond Lapping Compounds having grades of grain size 15 microns | Diamond Lapping Compounds having grades of grain size - 15 microns and packing of each 05 grams syringe | 150 | no | con2.gj | 120 |
| 9 | Diamond Lapping Compounds having grades of grain size 45 microns | Diamond Lapping Compounds having grades of grain size - 45 microns and packing of each 05 grams syringe | 180 | no | con2.gj | 120 |
| 10 | Diamond Lapping Compounds having grades of grain size25 microns | Diamond Lapping Compounds having grades of grain size - 25 microns and packing of each 05 grams syringe | 180 | no | con2.gj | 120 |
| 11 | Diamond Lapping Compounds having grades of grain size 70 microns | Diamond Lapping Compounds having grades of grain size - 70 microns and packing of each 05 grams syringe | 150 | no | con2.gj | 120 |
| 12 | Diamond Lapping Compounds having grades of grain size 90 microns | Diamond Lapping Compounds having grades of grain size - 90 microns and packing of each 05 grams syringe | 150 | no | con2.gj | 120 |
| 13 | Lapping abrasive liquid having grades of grain size 03 micron | Lapping abrasive liquid having grades of grain size- 03 micron suitable for use in lapping machine | 100 | litre | con2.gj | 120 |
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Certificate (Requested in ATC)
OEM Authorization Certificate
Additional Doc 1 (Requested in ATC) *In case any bidder is seeking exemption from Experience / Turnover Criteria
the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer
Extended Deadline
13-Nov-2024, 11:00 am
Opening Date
13-Nov-2024, 11:30 am
The eligibility requirements include being a registered entity, compliance with specified legal and financial documentation, and submission of OEM Authorization. Additionally, if seeking exemptions from experience or turnover criteria, bidders must provide relevant supporting documentation.
Bidders must submit several certificates, including OEM Authorization and any additional documents requested in the attached terms and conditions. It is essential to review the tender specifications for complete details.
Bidders can register for participation through the GeM portal, ensuring that all details align with the requirements of the GEM/2024/B/5392026 tender.
Bid submission should be in the formats specified in the tender document. It is recommended to refer to the main document for specific details on acceptable formats.
The technical specifications require compliance with the dimensions and quality standards outlined for lapping and polishing plates and compounds, as detailed in the tender documents.
Yes, all supplied items must meet recognized quality standards for industrial components. Bidder compliance will be assessed during the technical evaluation stage.
Bidders are required to comply with all technical specifications, provide necessary certifications, and fulfill any other conditions stipulated within the tender documents.
Testing criteria will be outlined within the technical specifications. Bidders should ensure that their products can withstand performance verification processes as described in the tender documents.
The Earnest Money Deposit (EMD) specified for this tender is ₹23,676. Bidders must ensure this deposit accompanies their submission.
The specific performance security requirements will be communicated to successful bidders upon the award of the contract.
Payment terms will be specified in the contract awarded after the tender evaluation and selection process. It is advisable for bidders to seek clarity during the tender negotiations.
The price evaluation will be determined on a total value basis, emphasizing cost-effectiveness while meeting quality and delivery requirements.
Bids must be submitted electronically through the GeM portal. Detailed instructions will be provided in the bid documents.
Notifications regarding the evaluation results will be communicated to all bidders after the completion of the assessment process.
Micro, Small, and Medium Enterprises (MSEs) may benefit from exemptions in criteria related to experience and turnover, promoting inclusiveness in participation.
Yes, there are provisions that may allow startups to seek exemptions based on specific criteria, which must be supported by appropriate documentation during the bidding process.
The tender promotes local manufacturing by encouraging participation from domestic suppliers, thereby contributing to the Make in India initiative and local content requirements.
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Main Document
OTHER
BOQ
BOQ
OTHER
GEM_GENERAL_TERMS_AND_CONDITIONS