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Office Of Dg ( Med & Cos) FPGA Development & Evaluation Board Tender Bangalore Karnataka 2026

Bid Publish Date

20-Feb-2026, 9:54 am

Bid End Date

27-Feb-2026, 10:00 am

Progress

Issue20-Feb-2026, 9:54 am
AwardPending
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Quantity

1

Bid Type

Two Packet Bid

Categories 1

Tender Overview

The Office Of Dg (Med & Cos) under the Department Of Defence Research & Development invites bids for a FPGA Development and Evaluation Board in BANGALORE, KARNATAKA. The scope includes Supply, Installation, Testing, Commissioning of the board, plus training of operators and any necessary statutory clearances. One day onsite training and demonstration will be provided to the CAI R team at CAIR, Bengaluru. The contract emphasizes a complete deliverable including setup and knowledge transfer, with an emphasis on OEM-authorized support for imported products. The BOQ shows no line items, indicating a broad evaluation board framework rather than a fixed item list. This procurement highlights advanced heterogeneous processing with multiple interfaces and expansion options, suitable for research and development in defense electronics.

Technical Specifications & Requirements

  • Category: Processor includes APU, GPU, Main Memory, RPU; Category: Programmable Logic includes # of logic cells, # of DSP SLICE, # of MMCM;
  • Peripheral Connectivity: USB 2.0 Host, MiniPCIe / mSATA dual slot, USB Type-C 3.1 Gen1 Dual-Role Device;
  • Network Connectivity: On-board Wi‑Fi, SFP+ 10G Ethernet, WLAN / WWAN / LoRa, Ethernet 1G w/ IEEE 1588;
  • Storage: Flash, SSD; Multimedia: HDMI Source, Audio Codec, HDMI Sink, DisplayPort, Pcam, Camera;
  • Expansion: High-speed - FMC Gigabit, Mid-speed - SYZYGY, Low speed - Pmod, Mid-speed - FMC, FMC;
  • Additional: Power, Warranty; The terms require on-site training, CAIR Bengaluru demonstration, and compliance with OEM after-sales support in India for imported products.

Terms, Conditions & Eligibility

  • Scope includes: Supply, Installation, Testing, Commissioning, and training of operators with any statutory clearances;
  • One day onsite training and demonstration to CAI R team at CAIR Bengaluru;
  • For imported products, the OEM or Authorized Seller must have a registered office in India for after-sales service; certificate to be submitted;
  • Certificates/documents must be uploaded as per Bid document/ATC; failure leads to rejection;
  • No BOQ items are listed, suggesting a flexible, board-level procurement rather than discrete components;
  • Compliance with all bid terms, including training delivery and post-sales support, is mandatory for bid evaluation.

Key Specifications

    • Processor: APU, GPU, Main Memory, RPU
    • Programmable Logic: # of logic cells, # of DSP SLICE, # of MMCM
    • Connectivity: USB 2.0 Host, MiniPCIe / mSATA dual slot, USB Type-C 3.1 Gen1 Dual-Role Device
    • Network: On-board Wi‑Fi, SFP+ 10G Ethernet, WLAN/WWAN/LoRa, Ethernet 1G w/ IEEE 1588
    • Storage: Flash, SSD
    • Multimedia: HDMI Source, Audio Codec, HDMI Sink, DisplayPort, Pcam, Camera
    • Expansion: High-speed FMC Gigabit, Mid-speed SYZYGY, Low speed Pmod, Mid-speed FMC, FMC
    • Warranty/Power/Additional: General warranty and power specifications mentioned

Terms & Conditions

  • EMD: Not specified in available data; submit as per bid documents

  • Delivery: Supply, installation, testing, commissioning with operator training

  • Warranty/After-sales: OEM/seller must have India-registered office for imported products

Important Clauses

Payment Terms

Payment terms to be as per standard DRDO buyer terms; details not provided in data

Delivery Schedule

Scope includes delivery, installation, testing, commissioning; exact timeline not specified

Penalties/Liquidated Damages

No explicit LD details available in supplied text

Bidder Eligibility

  • Experience in FPGA/Board development projects

  • Ability to supply and support FPGA development boards with required interfaces

  • OEM authorization for imported products with India-based after-sales support

Documents 7

GeM-Bidding-8889545.pdf

Main Document

Other Documents

OTHER

Other Documents

OTHER

Other Documents

OTHER

CATALOG-Specification-1

CATALOG Specification

Buyer uploaded ATC document

ATC

GEM General Terms and Conditions Document

GEM_GENERAL_TERMS_AND_CONDITIONS

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Technical Specifications 1 Item

Item #1 Details

View Catalog
Category Specification Requirement
Processor APU Quad A53, NA
Processor GPU Yes
Processor Main Memory DDR4, 4GB, 2133 MT/s, upgradeable
Processor RPU Yes
Processor Video Codec Yes
Programmable Logic # of logic cells 504K
Programmable Logic # of DSP SLICE 1728
Programmable Logic # of MMCM 8
Peripheral Connectivity USB 2.0 Host 1 x OTG
Peripheral Connectivity MiniPCIe / mSATA dual slot Yes
Peripheral Connectivity USB Type-C 3.1 Gen1 Dual-Role Device No
Network Connectivity On-board Wi-Fi No
Network Connectivity SFP+ 10G Ethernet No
Network Connectivity WLAN / WWAN / LoRa No
Network Connectivity Ethernet 1G w/ IEEE 1588 Yes
Storage Flash 128 Mib
Storage SSD Yes
Multimedia HDMI Source Yes
Multimedia Audio Codec No
Multimedia HDMI Sink No
Multimedia DisplayPort Yes
Multimedia Pcam No
Multimedia Camera USB 3.0
Expansion High-speed - FMC Gigabit No
Expansion Mid-speed - SYZYGY No
Expansion Low speed - Pmod NA
Expansion Mid-speed - FMC No
Expansion FMC LPC FMC
Additional Parameters Additional Info Manufacturers Authorization Letter
Additional Parameters Power External
Warranty/Service Warranty 0.25 Or higher

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Required Documents

1

GST Registration Certificate

2

Permanent Account Number (PAN) Card

3

Experience Certificates showing relevant FPGA/Board development work

4

Financial Statements (last 2-3 years)

5

EMD/Security Deposit as specified in bid document

6

Technical bid documents and compliance certificates

7

OEM Authorization / Authorized Seller certificate for imported products

8

Any certificates referenced in ATC/Corrigendum

Frequently Asked Questions

Key insights about KARNATAKA tender market

How to bid for FPGA development board tender in Bangalore

Bidders must submit GST, PAN, experience certificates, financial statements, and EMD per bid terms. Provide OEM authorization for imported products and documentation proving after-sales support in India. A one-day on-site training demonstration at CAIR Bengaluru is required; ensure compliance with ATC clauses.

What documents are required for FPGA board procurement in Bengaluru

Required documents include GST certificate, PAN, up-to-date experience certificates, financial statements, EMD/Security deposit, technical bid, OEM authorization for imports, and any certificates listed in the ATC/Corrigendum. Upload all as part of the bid submission package.

What are the technical specs for the FPGA development board in this DRDO tender

Specifications cover processor stack (APU, GPU, RPU, main memory), programmable logic metrics (#logic cells, #DSP slices, #MMCM), USB 2.0 Host, dual MiniPCIe/mSATA slots, USB-C 3.1 Gen1, on-board Wi‑Fi, SFP+ 10G Ethernet, LoRa/WLAN, Ethernet 1G with IEEE 1588, storage (Flash/SSD), HDMI, DisplayPort, camera interfaces, Pmod/FMC expansion, and required warranty terms.

What is the obligation for foreign FPGA boards under this bid in India

Imported products require an OEM or authorized seller with a registered Indian office to provide after-sales service. A certificate proving this must be submitted with the bid; one-day onsite training at CAIR Bengaluru is mandated.

When is the delivery and installation expected for the FPGA board tender

The scope requires delivery, installation, testing, commissioning, and operator training; however, a specific delivery timeline is not disclosed in the available data. Bidders should anticipate alignment with DRDO procurement timelines in the ATC and bid documents.

What are the post-sales support and warranty expectations for this board

The tender requires warranty and ongoing support as part of the supply contract; imported items require an India-based OEM support presence. Warranty duration and AMC terms are expected to be defined in the formal bid documents and ATC.

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