GEM

Hindustan Aeronautics Limited PCB Fabrication Tender Rangareddi Telangana 2026 U106.05 Specifications

Bid Publish Date

05-Jan-2026, 5:52 pm

Bid End Date

27-Jan-2026, 11:00 am

Progress

Issue05-Jan-2026, 5:52 pm
AwardPending
Explore all 4 tabs to view complete tender details

Quantity

42

Category

DVA SOM PCB FABRICATION U106.05.1100 00 SPECIFICATION AS PER THE ANNEXURE1

Bid Type

Single Packet Bid

Categories 8

Tender Overview

Hindustan Aeronautics Limited (HAL) invites a PCB fabrication procurement under the Department Of Defence Production for multiple U106.05.1100/1300/1200/0900/0800/1400 series specifications. The scope references SOM PCB, DATA CARD, MOTHER BOARD, FRONT PANEL, POWER SUPPLY, MEMORY MODULE fabrication per Annexure1. Location is Rangareddi, Telangana. The tender uses a flexible quantity clause allowing ±25% adjustment during order placement and currency, with delivery timelines tied to the original deadline and extended periods. The bidders should focus on technical capability to deliver multiple PCB subassemblies to HAL’s defense production needs in a compliant, traceable manner. Unique conditions include option-based quantity adjustment and GST treatment guidance.

Technical Specifications & Requirements

  • Product/service names: SOM PCB fabrication, DATA CARD fabrication, MOTHER BOARD fabrication, FRONT PANEL production, POWER SUPPLY PCB fabrication, MEMORY MODULE fabrication.
  • No explicit numerical dimensions or performance criteria are published in the provided data; however, the BOQ lists 6 items with unspecified quantities.
  • Standards/quality: Not specified in the data; bidder to reference Annexure1 specifications for each item.
  • Delivery/installation: Flexible delivery window dependent on option clause; minimum additional time rule specified as (increased quantity/original quantity) × original delivery period, minimum 30 days.
  • Certification: No explicit certifications listed; refer to annexure for any IS/ISO/BIS requirements.

Terms, Conditions & Eligibility

  • EMD: Not disclosed in the provided data; bidders should anticipate standard security deposit practices.
  • Price/GST: GST payable by bidder; GST rate to be applied as per applicable law with actuals reimbursement capped to quoted rate.
  • Delivery: Option-based quantity increases up to 25% during contract; delivery period calculation uses last order date with minimum 30 days.
  • Compliance: Bidders must comply with the option clause and deliver conforming components as per Annexure1; maximum flexibility on quantity exists.
  • Documentation: Typical bid submission requirements (GSTIN, PAN, experience, financials, OEM authorizations) are implied and should be verified in Terms & Conditions.

Key Specifications

    • Product/service names and categories: SOM PCB fabrication, DATA CARD fabrication, MOTHER BOARD fabrication, FRONT PANEL, POWER SUPPLY PCB fabrication, MEMORY MODULE fabrication
    • Estimated value/EMD: not disclosed in data; anticipate standard agency practice
    • Delivery scope: flexible with option clause allowing ±25% quantity variation
    • Standards/certifications: not specified; refer to Annexure1 for IS/ISO/BIS requirements
    • Testing/quality: not explicitly listed; ensure conformity to HAL/Defence Production quality procedures

Terms & Conditions

  • Option Clause allows quantity variation up to 25% during contract and currency

  • GST payable by bidder; reimbursement based on actuals or applicable rates

  • Delivery schedule tied to original delivery period with minimum 30 days extension

Important Clauses

Payment Terms

GST applicable at quoted rate; reimbursement as actuals or rate in effect; no responsibility on GST for purchaser

Delivery Schedule

Delivery period starts from last date of original delivery order; option-based extension follows the specified formula with minimum 30 days

Penalties/Liquidated Damages

Not detailed in provided data; standard HAL/Defence Production penalties to apply per annexure

Bidder Eligibility

  • Experience in PCB fabrication for defense or aerospace segments

  • Demonstrated capability to supply SOM, DATA CARD, MOTHER BOARD, FRONT PANEL, POWER SUPPLY, MEMORY MODULEs

  • Compliance with Annexure1 specifications and HAL/Defence Production procurement rules

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Bill of Quantities (BOQ) 6 Items

Item # Title Description Quantity Unit Consignee Delivery (Days)
1 DVA SOM PCB FABRICATION U106.05.1100 00 SPECIFICATION AS PER THE ANNEXURE1 DVA SOM PCB FABRICATION U106.05.1100 00 SPECIFICATION AS PER THE ANNEXURE1 6 pieces [email protected] 28
2 CONTROL CARD SOM PCB FABRICATION U106.05.1300 00 SPECIFICATION AS PER THE ANNEXURE1 CONTROL CARD SOM PCB FABRICATION U106.05.1300 00 SPECIFICATION AS PER THE ANNEXURE1 4 pieces [email protected] 28
3 DATA CARD SOM PCB FABRICATION U106.05.1200 00 SPECIFICATION AS PER THE ANNEXURE1 DATA CARD SOM PCB FABRICATION U106.05.1200 00 SPECIFICATION AS PER THE ANNEXURE1 4 pieces [email protected] 28
4 MOTHER BOARD PCB FABRICATION U106.05.0900 00 SPECIFICATION AS PER THE ANNEXURE1 MOTHER BOARD PCB FABRICATION U106.05.0900 00 SPECIFICATION AS PER THE ANNEXURE1 4 pieces [email protected] 28
5 FRONT PANEL AND POWER SUPPLY PCB FABRICATION U106.05.0800 00 SPECIFICATION AS PER THE ANNEXURE1 FRONT PANEL AND POWER SUPPLY PCB FABRICATION U106.05.0800 00 SPECIFICATION AS PER THE ANNEXURE1 4 pieces [email protected] 28
6 MEMORY MODULE PCB FABRICATION U106.05.1400-00 SPECIFICATION AS PER THE ANNEXURE1 MEMORY MODULE PCB FABRICATION U106.05.1400-00 SPECIFICATION AS PER THE ANNEXURE1 20 pieces [email protected] 28

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Required Documents

1

GST registration certificate

2

Permanent Account Number (PAN) card

3

Experience certificates for PCB fabrication projects

4

Financial statements (last 2-3 years)

5

EMD/Security deposit documentation (as per tender terms)

6

Technical bid documents demonstrating capability for SOM/ DATA CARD/ MOTHER BOARD/ MEMORY MODULE fabrication

7

OEM authorizations or allied supplier certifications

8

Any annexure-specific compliance certificates referenced in Annexure1

Frequently Asked Questions

Key insights about TELANGANA tender market

How to bid for HAL PCB fabrication tender in Rangareddi Telangana 2026

Bidders should submit GST registration, PAN, and experience certificates, along with a technical bid demonstrating capabilities in SOM/DATA CARD/MOTHER BOARD fabrication. The tender requires OEM authorizations and financial statements. Ensure compliance with Annexure1 specifications and observe the option-based quantity clause up to 25%.

What documents are required for HAL PCB fabrication bid in Telangana

Required documents include GST certificate, PAN, 2-3 years of financial statements, experience certificates for PCB fabrication, OEM authorizations, and technical bid. Also prepare EMD documentation as per tender terms and annexure-specific compliance certificates for defense production.

What are the technical specifications for HAL SOM PCB fabrication

Technical specifics are defined in Annexure1 for SOM PCB fabrication; the provided data lacks explicit dimensions. Bidder must review Annexure1 to confirm required board layers, materials, trace widths, impedance control, and environmental testing standards before submission.

When is delivery required for HAL PCB fabrication tender

Delivery periods align with the original delivery order date; the option clause allows a 25% quantity increase with calculated extension time, minimum 30 days, and potential extension within original delivery period according to the formula.

What is the EMD amount for HAL defense PCB tender 2026

The EMD amount is not disclosed in the data provided. Prospective bidders should check the tender’s payment terms section or annexure for the exact EMD value and acceptable payment method, ensuring readiness for submission alongside other bid documents.

How to ensure GST compliance for HAL procurement in Telangana

Bidders must determine GST applicability independently; HAL will reimburse GST as actuals or per applicable rates, whichever is lower, up to the quoted GST percentage. Include the GST details in the bid and ensure invoicing aligns with government tax rules.

What standards or certifications are required for HAL PCB bids

Standards are specified in Annexure1; bidders must confirm IS/ISO/BIS certifications and any organization-specific defense production requirements. Prepare documentation proving compliance with listed standards and attach relevant certificates with the bid.

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