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Indian Air Force RAM Module Tender India 2026 – RAM specifications, ECC, voltage, and warranty

Bid Publish Date

30-Jun-2026, 8:14 am

Bid End Date

14-Jul-2026, 9:00 am

Location

THANE , MAHARASHTRA

Progress

Issue30-Jun-2026, 8:14 am
AwardPending
Explore all 4 tabs to view complete tender details

Quantity

25

Bid Type

Two Packet Bid

Key Highlights

  • RAM Module procurement by Indian Air Force under Random Access Memory category
  • Up to 25% quantity increase/decrease rights during contract and currency
  • Delivery period logic tied to original delivery date with minimum 30 days extension
  • Hardware specifications to include ECC buffering, rated MT/s speed, form factor, pin configuration, and operating voltage
  • Warranty period to be specified; ensure compatibility with device class and rank configuration
  • No BOQ items available; bidders must rely on specification-based submission

Tender Overview

The Indian Air Force seeks RAM module supply under a government procurement process, categorized under Random Access Memory (RAM) Module (Q2). The tender encompasses architecture and performance criteria including memory generation, ECC buffering, memory capacity, and rated speed, with physical and electrical characteristics such as form factor, pin configuration, operating voltage, and rank configuration. The scope references compatible device classes and a defined warranty period. While the BOQ shows zero items, the opportunity targets RAM module vendors capable of meeting multi-parameter specs and reliability standards. The governing terms also authorize quantity flexibility up to 25% (increase/decrease) with rates unchanged, and delivery timelines tied to the original order’s last delivery date. This tender emphasizes precise RAM specification compliance and supplier readiness for agile order adjustments.

Technical Specifications & Requirements

  • Memory Generation / Technology: not explicitly stated; must align with procurement needs
  • System-level ECC and Buffering Class: required configuration detail to ensure data integrity
  • Memory Capacity (in GB): specified parameter to determine module size
  • Rated Memory Speed (in MT/s): performance criterion to match system requirements
  • Module Form Factor: defines physical compatibility with devices
  • Physical Pin Configuration: interface standard for motherboard/socket compatibility
  • Operating Voltage: electrical compatibility with system rails
  • Rank Configuration: single/multi-rank specification impacting performance
  • Compatible Device Class: expected device class alignment for deployment
  • Warranty Period (in Year): post-purchase support expectation; exact years to be confirmed

Terms, Conditions & Eligibility

  • Option Clause: Purchaser may adjust quantity by up to 25% at contract placement and during currency at contracted rates
  • Delivery window derives from the last date of the original delivery order; extended time follows the same logic, with minimum extended period of 30 days
  • Bidders must comply with the option clause and related delivery calculations; explicit acceptance required
  • EMD amount and applicable payment terms are not disclosed in the available data; bidders should verify in the formal tender pack
  • Ensure readiness for potential scope adjustments and delivery scheduling aligned to evolving requirements
  • Additional contractual nuances may apply per Buyer’s Terms and Conditions; confirm all clauses before bid submission

Key Specifications

  • Memory Generation / Technology

  • System-level ECC and Buffering Class

  • Memory Capacity (GB)

  • Rated Memory Speed (MT/s)

  • Module Form Factor

  • Physical Pin Configuration

  • Operating Voltage

  • Rank Configuration

  • Compatible Device Class

  • Warranty Period (Year)

Terms & Conditions

  • Option clause allows +/- 25% quantity change at contract and during currency

  • Delivery timing linked to last date of original delivery order with minimum 30 days extension

  • EMD amount and payment terms to be confirmed in tender documents

Important Clauses

Payment Terms

Payment terms not disclosed in data; bidders must review Terms and Conditions for schedule

Delivery Schedule

Delivery period determined from original order date; extended period follows same formula with 30-day minimum

Penalties/Liquidated Damages

Not specified in available data; verify in official tender pack

Bidder Eligibility

  • Experience in RAM module supply or related memory components

  • Compliance with ECC-buffered memory standards

  • Capability to meet 25% quantity fluctuation and delivery scheduling

Additional Tender Data

Commercial Details

Tender Category

Goods

Bid To RA

No

Bid To RA Enabled

Yes

Item Category

Random Access Memory (RAM) Module (Q2)

Authority Records

MINISTRY OF DEFENCEMILITARY AFFAIRS DEPARTMENTINDIAN AIR FORCE

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Documents 3

GeM-Bidding-9535294.pdf

Main Document

CATALOG-Specification-1

CATALOG Specification

GEM General Terms and Conditions Document

GEM_GENERAL_TERMS_AND_CONDITIONS

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Technical Specifications 1 Item

Item #1 Details

View Catalog
Category Specification Requirement
Architecture and Performance Memory Generation / Technology DDR4 Or higher
Architecture and Performance System-level ECC and Buffering Class Non-ECC Unbuffered
Architecture and Performance Memory Capacity (in GB) 16.0 Or higher
Architecture and Performance Rated Memory Speed (in MT/s) 2666.0 Or higher
Physical and Electrical Characteristics Module Form Factor DIMM
Physical and Electrical Characteristics Physical Pin Configuration 288 Pins
Physical and Electrical Characteristics Operating Voltage 1.20 V
Physical and Electrical Characteristics Rank Configuration Single Rank (1Rx), Dual Rank (2Rx), Quad Rank (4Rx), Octal Rank (8Rx) Or higher
Compatibility and Warranty Compatible Device Class Desktop Computer
Compatibility and Warranty Warranty Period (in Year) 1, 2, 3, 5 Or higher

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Historical Data

Required Documents

1

GST registration certificate

2

Permanent Account Number (PAN) card

3

Experience certificates for RAM module supply

4

Financial statements for last 1-3 years

5

EMD submission evidence (as per tender pack)

6

Technical bid documents demonstrating RAM specifications compliance

7

OEM authorization or dealer/distributor certifications (if required)

Frequently Asked Questions

How to bid RAM module tender in India for IAF 2026?

Bidders must prepare RAM module submissions aligned with architecture and performance specs, ECC buffering, and voltage requirements. Ensure OEM authorizations, GST/PAN, and financials are ready. The tender allows up to 25% quantity fluctuation; confirm delivery timelines from the original order date and adhere to payment/EMD terms once published.

What documents are required for RAM tender submission in India?

Submit GST certificate, PAN card, RAM-specific experience certificates, last 3 years financial statements, EMD evidence, technical compliance documents, and OEM authorization if applicable. Include RAM capacity, speed, form factor, pin configuration, and warranty details to demonstrate specification alignment.

What are the RAM technical specifications for this IAF tender?

Key specs include memory generation/technology, ECC buffering, memory capacity in GB, rated MT/s speed, module form factor, pin configuration, operating voltage, rank configuration, and compatibility with the intended device class. The exact years of warranty must be confirmed in the tender pack.

When is the delivery window for RAM modules under this tender?

Delivery timing is calculated from the last date of the original delivery order, with extensions permissible if the option clause is exercised. Any extended period must at least equal the original period or follow the formula (increase/decrease quantity ÷ original quantity) × original delivery period, minimum 30 days.

What are the EMD and payment terms for the RAM tender?

Exact EMD amount and payment terms are not disclosed in the available data. Bidders should consult the official tender documents for EMD submission method (DD/online) and payment schedule, including any milestone-based payments or advance requirements once published.

Which RAM standards and brand requirements apply to this IAF procurement?

The tender requests architecture and performance specifications with ECC buffering and compatibility constraints. Ensure RAM modules meet device-class compatibility and warranty expectations. OEM authorizations or brand-specific certifications may be required; verify in the tender pack for any IS/industry standards applicability.

How to verify RAM module compatibility with IAF device class?

Cross-check module form factor, pin configuration, voltage, and rank configuration against the compatible device class specified in the tender. Request vendor datasheets showing MT/s speed, ECC buffering specs, and warranty period to confirm alignment with IAF deployment requirements.

What is the scope of quantity changes during contract for RAM modules?

The purchaser may adjust quantity by up to 25% at contract placement and during currency at the same contracted rates. Ensure supply chains and inventory plans can accommodate fluctuation while maintaining delivery schedules and warranty commitments.

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