Printed Circuit Board,Printed Circuit Board,Printed Circuit Board,Printed Circuit Board
Indian Air Force
JAMNAGAR, GUJARAT
Posted:
24 January 2025
Closed:
8 February 2025
GEM
GEM
Indian Air Force Printed Circuit Board Tender 2026 Gujarat Mumbai - PCB Layer & Board Thickness Standards 2026
Bid Publish Date
15-Jul-2026, 11:42 am
Bid End Date
29-Jul-2026, 9:00 am
Location
Progress
Issue15-Jul-2026, 11:42 am
AwardPending
Quantity
3
Bid Type
Single Packet Bid
Categories
2
Tender Overview
Indian Air Force invites bids for a Printed Circuit Board (Q3) with emphasis on Layer and Board Thickness. The procurement includes Supply, Installation, Testing and Commissioning of goods, with a total scope covering the full SITC cycle. While the BOQ shows 0 items, the tender emphasizes firm capability to meet technical specifications and post-sales service via a dedicated toll-free support line. Location and exact end-user department are not disclosed, indicating a national-level Air Force procurement process. The emphasis on buyer specification attachment and recent item supply experience differentiates bidders by demonstrated domain expertise and verified project history. The ATC guidelines request CRAC/contract/experience documentation for technical evaluation, signaling a stringent qualification phase.
Technical Specifications & Requirements
- Category: Technical Parameter; Focus: Layer, Board Thickness
- Warranty: Explicitly requested under Generic specifications
- Scope of Supply: Supply, Installation, Testing and Commissioning included in bid price
- Mandatory documents: Attach buyer’s specification with firm stamp and signature; submit experience certificates/CRAC copies and payment detail evidence for past items
- Service & Support: Must provide a dedicated toll-free service number for post-sale support
- ATC Clause: Buyer-uploaded ATC requires firm compliance with the attached specification and GEM contract nuances
- This tender requires a technical evaluation based on supplied documentation rather than BOQ quantity
Terms, Conditions & Eligibility
- EMD/guarantee details: Not disclosed; bidders must satisfy at least documented experience in supplied similar items
- Delivery/Timeline: Not specified in data; SITC scope implies delivery, installation, and commissioning obligations
- Payment terms: Not stated; scope includes SITC components, suggesting standard government payment terms post-acceptance
- Documentation: GST, PAN, experience certificates, supplier declarations, and OEM or vendor authorizations may be required per ATC
- Warranty/Support: Warranty duration to be aligned with buyer specification; dedicated service channel must be functional
- Evaluation: Technical evaluation hinges on attaching buyer specification and CRAC/experience proofs
- Brand/OEM: None explicitly specified besides buyer spec attachments
Key Specifications
-
- Product category: Printed Circuit Board (Q3)
- Technical parameters: Layer; Board Thickness
- Warranty: as per buyer specification
- Scope: Supply, Installation, Testing and Commissioning of goods
- Support: dedicated toll-free service support
- Documentation: Attach buyer specification with firm stamp; CRAC copy and past item experience proofs
- BOQ items: 0 items listed; emphasis on technical evaluation instead
Terms & Conditions
-
Key Term 1: Mandatory attachment of buyer's specification with firm stamp for technical evaluation
-
Key Term 2: Dedicated toll-free service support requirement from bidder/OEM
-
Key Term 3: SITC scope to be included in bid price (Supply, Installation, Testing and Commissioning)
Important Clauses
Payment Terms
Not specified in data; standard government terms may apply post-acceptance
Delivery Schedule
Delivery timelines are not disclosed; SITC scope implies phased installation and commissioning
Penalties/Liquidated Damages
Not specified; ATC may define penalties for non-compliance with technical specs
Bidder Eligibility
-
Demonstrated experience in supplying similar printed circuit boards or related electronics (CRAC copy acceptable)
-
Ability to provide dedicated toll-free service support post-sale
-
Compliance with attached buyer specifications and OEM authorization if required
Additional Tender Data
Commercial Details
Tender Category
Goods
Bid To RA
No
Bid To RA Enabled
No
Item Category
Printed Circuit Board (Q3)
Delivery Details
Max Delivery Days
30
Delivery Locations
1
Delivery Cities
JODHPUR CITY
Delivery Locations
| Consignee | Address | City | State | Pincode | Quantity | Delivery Days | Additional Requirement |
|---|---|---|---|---|---|---|---|
| - | JODHPUR CITY | JODHPUR CITY | - | - | 3 | 30 | - |
Authority Records
MINISTRY OF DEFENCEMILITARY AFFAIRS DEPARTMENT
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Documents 4
GeM-Bidding-9608720.pdf
Main Document
CATALOG-Specification-1
CATALOG Specification
Other Documents
OTHER
GEM General Terms and Conditions Document
GEM_GENERAL_TERMS_AND_CONDITIONS
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Tender Results
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Technical Specifications
1 Item
Item #1 Details
View Catalog| Category | Specification | Requirement |
|---|---|---|
| Technical Parameter | Layer | 4 |
| Technical Parameter | Board Thickness | 1.6 |
| Generic | Warranty | 12.0 |
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Required Documents
1
GST certificate
2
PAN card
3
Experience certificates (CRAC copy acceptable; GEM contract copy not treated as experience certificate)
4
Financial statements (as applicable to bid)
5
EMD/Security deposit details (not specified in data; provide as per ATC if required)
6
Technical bid documents
7
OEM authorizations (if required by ATC)
8
Buyer’s specification attached with firm stamp and signature
Frequently Asked Questions
How to bid on printed circuit board tender in India for IAF 2026?
Submit technical bid with attached buyer specification bearing firm stamp, provide CRAC copies as evidence of past items, include dedicated toll-free service capability, and ensure SITC scope is included in the bid price. Ensure OEM authorizations if required and attach GST/PAN documents.
What documents are required for IAF PCB tender participation 2026?
Submit GST registration, PAN card, experience certificates (CRAC copies acceptable), financial statements, technical bid, OEM authorization if applicable, and the buyer's specification with firm stamp for technical evaluation.
What are the technical specifications for PCB tender layer and thickness?
The tender specifies Layer and Board Thickness as key technical parameters; exact numbers are not provided here. Bidders should refer to the attached buyer’s specification to ensure exact layer counts and thickness tolerances.
What is the scope of supply for the IAF PCB bid 2026?
Scope includes Supply, Installation, Testing and Commissioning of goods; the bid price must cover all cost components associated with SITC activities and post-implementation support.
What is required for post-sale service in IAF PCB tender?
A dedicated toll-free service number must be provided by the bidder/OEM for service support, ensuring prompt assistance during the warranty and post-warranty periods.
When is the delivery/installation timeline for the IAF PCB procurement?
The exact delivery schedule is not disclosed in the data; bidders should prepare for a SITC-based timeline and await detailed ATC/norms in the buyer specification.
What standards or certifications are required for IAF PCB tender?
The tender requires adherence to the buyer's specification; OEM authorizations and CRAC/experience documents are used for technical evaluation. Specific ISI/ISO standards are not listed in the data provided.
How to attach the buyer's specification for IAF technical evaluation?
Prepare the buyer's specification document, stamp it with your firm seal, and upload it with your technical bid as part of the mandatory ATC submission for evaluation.
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Documents 4
GeM-Bidding-9608720.pdf
Main Document
CATALOG-Specification-1
CATALOG Specification
Other Documents
OTHER
GEM General Terms and Conditions Document
GEM_GENERAL_TERMS_AND_CONDITIONS