Indian Army De-Soldering Wire, Soldering Paste & Related Accessories Tender Kangra Himachal Pradesh 2026

Tender Overview

This procurement by the Indian Army under the Department Of Military Affairs targets multiple soldering and PCB consumables including H1_NK001109_DE-SOLDERING WIRE, H1_NK001108_SOLDERING PASTE, H1_NK001110_SOLDERING WIRE, H1_NK001469_TEFLON WIRE 1.5MM, Y3_IYC-0839_INSULATION TAPE, H1_NK001332_SILICON TUBE, H1_NK001546_POLYBAGS FOR PCB BOARD, H1_NK001466_FEVIQUICK, and H4_9330-00028_FILM POLYTHENE 0.25MM located in KANGRA, HIMACHAL PRADESH - 176001. The BOQ indicates a total of 9 items across packaging, insulation, and soldering consumables. A sample submission is required at 9 Corps Zone Wksp, c/o 56 APO, Damtal, Himachal Pradesh by 22 July 2026, including technical specifications. The Purchaser reserves a 50% quantity variation up or down at contract award and during the contract period at contracted rates.

Technical Specifications & Requirements

• Product names and basic scope derived from tender title: de-soldering wire, soldering paste, soldering wire, teflon wire 1.5mm, insulation tape, silicon tube, polybags for PCB board, Feviquick (adhesive), and polyethylene film (0.25mm).
• Sample submission deadline and location: 22 July 2026 at 9 Corps Zone Wksp, c/o 56 APO, Damtal, Himachal Pradesh; sample must accompany technical specifications and documents.
• No explicit performance standards or material specifications are provided in the data; bidders should anticipate basic quality compatibility checks during TEC stage.
• If any scope variations arise, quantities may shift up to 50% of bid quantity with corresponding delivery adaptations.
• The 9 items collectively imply a mixed supply contract including adhesives, fasteners, insulating materials, and packaging supplies suitable for PCB assembly and field repair kits.

Terms, Conditions & Eligibility

• Option Clause: 50% quantity adjustment allowed at contract placement and during currency at contracted rates; delivery period adjusts proportionally with a minimum of 30 days.
• Sample/TEC requirement: Submit sample by 22 July 2026; sample must meet the stated quality standards as per purchaser’s assessment; failure may lead to bid rejection.
• Certificates and documents: Bidders must upload all certificates/documents sought in the Bid Document, ATC, and Corrigendum; incomplete submissions risk rejection.
• Delivery/location: Delivery schedule linked to original delivery order; extended periods follow the option clause using the formula provided in terms.
• Sample submission location: TEC stage submission at 9 Corps Zone Workshop, C/O 56 APO, Damtal, Himachal Pradesh; ensure accompanying technical specs.
• Prequalification: Eligibility criteria and documentation align with standard government procurement expectations; OEM authorizations and technical compliance are typically required.